1992
DOI: 10.1016/0921-5093(92)90151-p
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Influence of oxygen on dynamic recrystallization during hot working of polycrystalline copper

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Cited by 46 publications
(15 citation statements)
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“…According to the viewpoints of Ravichandran and Prasad (1992), nucleation rate of austenitic grains in material with low stacking fault energy is lower since the dynamic recrystallization is controlled by it. Optical micrographs of the specimens deformed at 950 • C, 0.001 s −1 and 1100 • C, 10 s −1 showing dynamic recrystallization are displayed in Fig.…”
Section: Definition Of Dynamic Recrystallization Regionmentioning
confidence: 99%
“…According to the viewpoints of Ravichandran and Prasad (1992), nucleation rate of austenitic grains in material with low stacking fault energy is lower since the dynamic recrystallization is controlled by it. Optical micrographs of the specimens deformed at 950 • C, 0.001 s −1 and 1100 • C, 10 s −1 showing dynamic recrystallization are displayed in Fig.…”
Section: Definition Of Dynamic Recrystallization Regionmentioning
confidence: 99%
“…In ETP copper, most of the oxygen is present in the form of Cu 2 O particles in (Cu) matrix. The hot deformation behavior of copper of different oxygen grades has been studied by several investigators [2][3][4][5][6][7][8][9][10] and dynamic recrystallization (DRX) process has been identified to be the softening mechanism. In these investigations, different temperature and strain rate ranges have been used, which often did not overlap.…”
Section: Introductionmentioning
confidence: 99%
“…Classically, oxygen is introduced in the wire to improve the recrystallization. Indeed, many authors reported the beneficial effect of the oxygen content on recrystallization (Coutsouradis et al, 1974;Ravichandran & Prasad, 1992;Pops & Holloman, 1994;Jakani et al, 2004). Coutsouradis et al (1974) explained that the presence of oxygen essentially as Cu 2 O, can favor recrystallization by combination with other deleterious elements.…”
Section: Discussionmentioning
confidence: 99%
“…Their study showed a clear decrease of the recrystallization temperature with the increase of the oxygen content. Ravichandran & Prasad (1992) wrote that the Cu 2 O oxides increased the dynamic recrystallization rate by increasing the rate of dislocation generation and hence the nucleation rate. In the present work, Cu 2 O are also observed in the wire and could favor recrystallization.…”
Section: Discussionmentioning
confidence: 99%