2015
DOI: 10.4028/www.scientific.net/amm.773-774.657
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Influence of Oxygen Flow Rate on the Characteristics of the Tungsten Oxide Using RF Magnetron Sputtering

Abstract: Abstract-Tungsten Oxide (WO3) thin films were deposited using 99.9% pure tungsten target onto ITO substrate using RF magnetron sputtering in the range oxygen flow rates of 30-50%. The influence of the oxygen flow rate on characteristic of WO3 thin films has been investigated. The transmittance, resistivity, crystallite, roughness, and surface morphology were measured by UVVis, 2-point probe, X-Ray Diffraction (XRD), Atomic Force Microscopy (AFM), and Field Emission Scanning Electron Microscopy (FE-SEM) respect… Show more

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“…Magnetron sputtering has many benefits over other methods, including uniformity, smoothness, and strong adhesion deposition over a very substantial region. The ability to select substrate and target materials with high melting points and a high deposition rate enables simple manipulation of deposited layer thickness [73]. However, the reactive sputtering method has a variety of drawbacks, including target poisoning, low deposition rates, and arcing that produces imperfections in thin films [74].…”
Section: B Sputtering Techniquesmentioning
confidence: 99%
“…Magnetron sputtering has many benefits over other methods, including uniformity, smoothness, and strong adhesion deposition over a very substantial region. The ability to select substrate and target materials with high melting points and a high deposition rate enables simple manipulation of deposited layer thickness [73]. However, the reactive sputtering method has a variety of drawbacks, including target poisoning, low deposition rates, and arcing that produces imperfections in thin films [74].…”
Section: B Sputtering Techniquesmentioning
confidence: 99%