2011
DOI: 10.1016/j.phpro.2011.06.067
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Influence of Oxygen Flow Rate on the Variation of Surface Roughness of Fused Silica during Plasma Polishing Process

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Cited by 6 publications
(4 citation statements)
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“…This is expected as increasing the amount of oxygen usually impedes the roughening effects of plasma. 34…”
Section: Resultsmentioning
confidence: 99%
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“…This is expected as increasing the amount of oxygen usually impedes the roughening effects of plasma. 34…”
Section: Resultsmentioning
confidence: 99%
“…This is expected as increasing the amount of oxygen usually impedes the roughening effects of plasma. 34 Second, the influence of pressure and plasma exposure duration on surface roughness was investigated. The 15 cc min −1 oxygen flow rate was chosen for this set of experiments because it resulted in greater roughness values compared to higher flow rates.…”
Section: Resultsmentioning
confidence: 99%
“…Such process gives opportunity to decrease of quartz sample roughness in two times (up to Ra=0,8 nm) and to create chemical clean surface without any defects. The results of quartz glass polishing by means of such gas as SF6, Ar or O2 RF plasma are represented in [6,7].…”
Section: Results Of the Polishing Vacuum Methods Researchmentioning
confidence: 99%
“…The plasma is produced by using a particular RF power source. 56 There are three gas sources in the system. The pumping system and gas-flow controllers are used in the system to keep the working pressure constant.…”
Section: Polishing Processes For Optical Componentsmentioning
confidence: 99%