Influence of Noise in Computer-Vision-Based Measurements on Parameter Identification in Structural Dynamics

Abstract

Nowadays, consumer electronics offer computer-vision-based (CV) measurements of dynamic displacements with some trade-offs between sampling frequency, resolution and low cost of the device. This study considers a consumer-grade smartphone camera based on complementary metal-oxide semiconductor (CMOS) technology and investigates the influence of its hardware limitations on the estimation of dynamic displacements, modal parameters and stiffness parameters of bolted connections in a laboratory structure. An algorithm that maximizes the zero-normalized cross-correlation function is employed to extract the dynamic displacements. The modal parameters are identified with the stochastic subspace identification method. The stiffness parameters are identified using a model-updating technique based on modal sensitivities. The results are compared with the corresponding data obtained with accelerometers and a laser distance sensor. The CV measurement allows lower-order vibration modes to be identified with a systematic (bias) error that is nearly proportional to the vibration frequency: from 2% for the first mode (9.4 Hz) to 10% for the third mode (71.4 Hz). However, the measurement errors introduced by the smartphone camera have a significantly lower influence on the values of the identified stiffness parameters than the numbers of modes and parameters taken into account. This is due to the bias–variance trade-off. The results show that consumer-grade electronics can be used as a low-cost and easy-to-use measurement tool if lower-order modes are required.

Implementation of Multi-Type Sensor Placement Strategy for Large-Scale Engineering Structures

“…Measurements of displacement can be conducted using various methods, among which direct reference-based techniques such as linear variable differential transducers, laser Doppler vibrometers, and computer vision-based systems [14] are most popular. Additionally, combined [15] and indirect methods [16] are often employed.…”