Advanced functional coatings with applications ranging from wear-resistant layers on cutting tools [1,2] to diffusion barriers in electronic devices [3,4] are often produced with the advantage of reactive magnetron sputtering under high vacuum conditions. The presence of a reactive gas, however, leads not only to the desired compound formation at the substrate, but also to a simultaneous chemisorption at the target that is covered with a compound layer by so-called target poisoning. This results in severe reduction of the sputtering rate and large off-sets in the process parameter operating points, because of the change in the secondary electron emission yield and the chemical composition of the sputtered flux, as well as the energy distribution thereof, [5,6] ion implantation effects, [7] and process hysteresis [8].