Influence of Morphology and Surface Modification of MgO on Thermal Characteristics of Epoxy Composite

Abstract

The advancement in electronic device miniaturization has led to an increase in thermal issues. The reliability of these devices depends on heat dissipation, leading to the development of thermal interface materials (TIMs). In this study, the influence of morphology and surface modification on the thermal characteristics of magnesium oxide (MgO) incorporated epoxy composites was investigated. A wet precipitation method was employed for the synthesis of spherical S-MgO. However, oblong hexagonal H-MgO was obtained via a hydrothermal process. Fillers were functionalized with (3-Aminopropyl) triethoxysilane (APTES) to improve interfacial bonds. APTES modified oblong hexagonal MgO (AH-MgO) showed better thermal conductivity compared to APTES modified spherical MgO (AS-MgO). By the inclusion of 20 wt. % filler, the thermal conductivity of AH-MgO was enhanced ∼8.5 fold (1.88 W.m −1 .K −1 ) compared to neat epoxy (0.2 W.m −1 .K −1 ), which remains lower in AS-MgO ∼1.8 W.m −1 .K −1 (8 fold). AH-MgO-Epoxy exhibits improved thermal stability with an activation energy (Ea) of 98.10 KJ mol −1 in comparison to AS-MgO-Epoxy (90.56 KJ mol −1 ). The oblong hexagonal structure of AH-MgO facilitates more phonon transportation due to the elongated thermal conductive paths. Moreover, surface modification further advances interface with the epoxy matrix. The developed composite can be use as alternative TIMs for electronic packaging.

Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires

“…Therefore, to enhance the bonding strength between PDMS an the hydrophilic surface of the MgO structures was modified to a hydrophobic using APTES, which is a silane coupling agent. This modification prevented the ysis of MgO and suppressed the formation of pores at the interface between th and polymer matrices [28]. A thin layer was uniformly coated on the surface modified MgO structures without a significant collapse in the structure (Figur Figure 3c illustrates the FT-IR spectra of the unmodified MgO and APTES and m MgO structures.…”

Nanocrystalline Composite Layer Realized by Simple Sintering Without Surface Treatment, Reducing Hydrophilicity and Increasing Thermal Conductivity

“…They have reported that the MgO filler content was ≈20 wt.% which was much lower than 90 wt.% of a commercial alumina TIM. [ 14 ] Hence, MgO and the other materials [carbon nano‐tube (CNT), BN etc.] are used together to obtain the high thermal conductivity.…”

“…Recently, the TIM studies have begun to utilize MgO as a thermal filler material, TIM which has a low ratio of MgO filler ratio (≈20 wt.%) has been reported continuously. [ 14 ] In order to obtain high thermal conductivities in heat dissipation materials, the ratio of thermal filler must be high, and the ratio of ceramic filler is ≈90 wt.% in commercial heat dissipation materials. The usage of MgO alone as a ceramic filler is difficult, since MgO does not mix well with polymers due to the rough surface of a MgO filler.…”

In situ generated gas bubble-directed self-assembly of multifunctional MgO-based hybrid foams for highly efficient thermal conduction, microwave absorption, and self-cleaning

“…6d). 2,5,7,9,11,[35][36][37][38][39][40][41][42][43][44][45][46]48 The heat transfer pathway of foams largely depends on their composition. Herein, MgO/Mg(OH) 2 /C foams are composed of MgO, Mg(OH) 2 , and amorphous C; MgO/Co/C foams consist of Co 0 , MgO, and amorphous C. Heat is transferred via electrons in Co 0 and crystal lattice vibrations (phonons) in MgO, Mg(OH) 2 , amorphous C, and pure silica films.…”