This paper has been peer-reviewed but does not include the final publisher proof-corrections or journal pagination.
Citation for the original published paper (version of record):Payandeh, M., Sjölander, E., Jarfors, A., Wessén, M. (2016) Influence of microstructure and heat treatment on thermal conductivity of rheocast and liquid die cast Al-6Si-2Cu-Zn alloy.
International Journal of Cast Metals
AbstractThermal conductivity of a rheocast telecom component made from Stenal Rheo1 (Al-6Si-2Cu-Zn) alloy was investigated in as-cast, T5 and T6 conditions. Conventionally liquid die cast samples were used as reference material. In the as-rheocast condition, a thermal conductivity of 153 W/mK at room temperature was measured. A T5 treatment at 250 or 300°C increased thermal conductivity to 174 W/mK. A T6 treatment resulted in further increase in thermal conductivity to 182 W/mK. The liquid die cast material exhibited lower thermal conductivity and higher hardness for all conditions compared to the as-rheocast material.The microstructural investigation revealed that the rheocast material consisted of coarse α1-Al particles formed during slurry preparation and fine α2-Al particles formed during solidification in the die cavity. Macrosegregation was observed as different the ratio of α1-Al particles to α2-Al particles in different locations in the rheocast component. The relation between microstructural characteristics and thermal diffusivity was investigated by determination of local thermal conductivity in the rheocast component and ratio of α1-Al particles to α2-Al particles. The results revealed that regions of rheocast component with a high amount of α1-Al particles showed higher thermal conductivity. WDS measurement showed that α1-Al particles contains lower concentrations of both Si and Cu inside compare to α2-Al particles. The reduced amount of solutes in the α1-Al particles was therefore determined as the root cause to higher thermal conductivity.Silicon precipitation was confirmed using calorimetry and dilatometry to take place between 200 and 250°C. A linear relation between the fraction of Si precipitates formed and the increase in thermal diffusivity was obtained. Silicon in solid solution is shown to have a strong influence (negative) on thermal conductivity. As silicon was precipitated during the heat treatment, thermal conductivity increased. For an optimal combination of thermal and mechanical properties it is therefore important to use an ageing temperature above the temperature for Si precipitation.