Influence of Material Coating on the Heat Transfer in a Layered Cu-SiC-Cu Systems

Strojny-Nędza, Agata; Pietrzak, K.; Teodorczyk, M.; Basista, Michał; Węglewski, Witold; Chmielewski, Marcin

doi:10.1515/amm-2017-0199

Cited by 5 publications

(2 citation statements)

References 8 publications

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“…Strojny-Nędza A, et al studied SiC/Cu composites using spark plasma sintering, and Cu-SiC-Cu systems were obtained after processing. They found that the copper reacts with the silicon carbide (6H-SiC type) during the process of annealing at high temperature [32]. According to the above, SiC/Cu interfacial investigations are crucial to the properties of the SiC/Cu composites.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method

et al. 2021

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The interfacial mechanics and electrical properties of SiC reinforced copper matrix composites were studied via the first principles method. The work of adhesion (Wad) and the interfacial energies were calculated to evaluate the stabilities of the SiC/Cu interfacial models. The carbon terminated (CT)-SiC/Cu interfaces were predicted to be more stable than those of the silicon terminated (ST)-SiC/Cu from the results of the Wad and interfacial energies. The interfacial electron properties of SiC/Cu were studied via charge density distribution, charge density difference, electron localized functions and partial density of the state. Covalent C-Cu bonds were formed based on the results of electron properties, which further explained the fact that the interfaces of the CT-SiC/Cu are more stable than those of the ST-SiC/Cu. The interfacial mechanics of the SiC/Cu were investigated via the interfacial fracture toughness and ultimate tensile stress, and the results indicate that both CT- and ST-SiC/Cu interfaces are hard to fracture. The ultimate tensile stress of the CT-SiC/Cu is nearly 23 GPa, which is smaller than those of the ST-SiC/Cu of 25 GPa. The strains corresponding to their ultimate tensile stresses of the CT- and ST-SiC/Cu are about 0.28 and 0.26, respectively. The higher strains of CT-SiC/Cu indicate their stronger plastic properties on the interfaces of the composites.

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Section: Introductionmentioning

confidence: 99%

Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method

et al. 2021

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“…Chen, G.Q et al found that layered interfacial products were consisted by SiC particles, a Cu-Si layer, a polycrystalline C layer and Cu-Si matrix, but no CuSi3 product was detected in these reacted regions [31]. Strojny-Nędza A, et al studied the SiC/Cu composites by using the spark plasma sintering and Cu-SiC-Cu and systems were obtained, and they found that the copper reacts with the silicon carbide (6H-SiC type) during the processing of the annealing at a high temperature [32]. According to the discussions above, it can be found that the SiC/Cu interfacial investigation is very crucial to the properties of the SiC/Cu composites.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix studied by the First Principles Method

Shu¹,

Zhang²,

Xiong³

et al. 2021

Preprint

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The interfacial mechanics and electrical properties of the SiC reinforced copper matrix composites were studied via the first principles method. The work of adhesion (Wad) and the interfacial energies were calculated to evaluate the stabilities of the SiC/Cu interfacial models. The carbon terminated (CT)-SiC/Cu interfaces were predicted more stable than those of the silicon terminated (ST)-SiC/Cu from the results of the Wad and interfacial energies. The interfacial electron properties of SiC/Cu were studied via the charge density distribution, charge density difference, electron localized functions and partial density of the state. The covalent C-Cu bonds were formed based on the results of the electron properties, which further explained the fact that the interfaces of the CT-SiC/Cu are stable than those of the ST-SiC/Cu. The interfacial mechanics of the SiC/Cu were investigated via the interfacial fracture toughness and ultimate tensile stress, and the results indicate that both CT- and ST-SiC/Cu interfaces are hard to fracture. The ultimate tensile stress of the CT-SiC/Cu is nearly 23GPa, which is smaller than those of the ST-SiC/Cu of 25 GPa. The strains corresponding to their ultimate tensile stresses of the CT- and ST-SiC/Cu are about 0.28 and 0.26, respectively. The higher strains of CT-SiC/Cu indicate their stronger plastic properties on the interfaces of the composites.

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Thermal Conductivity of AlSi12/Al2O3-Graded Composites Consolidated by Hot Pressing and Spark Plasma Sintering: Experimental Evaluation and Numerical Modeling

Sequeira,

Węglewski,

Bochenek

et al. 2024

Metall Mater Trans A

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Functionally graded metal matrix composites have attracted the attention of various industries as materials with tailorable properties due to spatially varying composition of constituents. This research work was inspired by an application, such as automotive brake disks, which requires advanced materials with improved wear resistance on the outer surface as combined with effective heat flux dissipation of the graded system. To this end, graded AlSi12/Al2O3 composites (FGMs) with a stepwise gradient in the volume fraction of alumina reinforcement were produced by hot pressing and spark plasma sintering techniques. The thermal conductivities of the individual composite layers and the FGMs were evaluated experimentally and simulated numerically using 3D finite element (FE) models based on micro-computed X-ray tomography (micro-XCT) images of actual AlSi12/Al2O3 microstructures. The numerical models incorporated the effects of porosity of the fabricated AlSi12/Al2O3 composites, thermal resistance, and imperfect interfaces between the AlSi12 matrix and the alumina particles. The obtained experimental data and the results of the numerical models are in good agreement, the relative error being in the range of 4 to 6 pct for different compositions and FGM structure. The predictive capability of the proposed micro-XCT-based FE model suggests that this model can be applied to similar types of composites and different composition gradients.

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Influence of Material Coating on the Heat Transfer in a Layered Cu-SiC-Cu Systems

Cited by 5 publications

References 8 publications

Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method

Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method

Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix studied by the First Principles Method

Thermal Conductivity of AlSi12/Al2O3-Graded Composites Consolidated by Hot Pressing and Spark Plasma Sintering: Experimental Evaluation and Numerical Modeling

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