Influence of manufacturing parameters on the PD-behaviour of AlN-substrates

Ebke, T.; Peier, D.; Engel, K. Temmen nee

doi:10.1049/cp:19990926

Cited by 2 publications

(3 citation statements)

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“…In addition, optimized manufacturing processes, for instance for etching or polishing, as well as a rounded shape of the metallization layout can contribute to the reduction of PD. [22,23] Many tests were done on the localization of the critical sections in the module and the electrical insulation itself. Also many optimizations have been carried out.…”

Section: E16-003-2mentioning

confidence: 99%

Partial Discharges in Ceramic Substrates - Correlation of Electric Field Strength Simulations with Phase Resolved Partial Discharge Measurements

Bayer

Waltrich

Soueidan

et al. 2016

Transactions of The Japan Institute of Electronics Packaging

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High voltages and the edges of the metallization on ceramic substrates (AMB, DBA, DBC, HTCC, LTCC) lead to high electric field strengths. In the vicinity of the metal edges these high electric field strengths induce partial discharges in the ceramic insulation and in the potting and thereby represent one key degradation mechanism of power modules. In this work the correlation of the simulated electric field strength with phase resolved partial discharge (PRPD) measurements has been investigated. For the simulation of the electric field strength a new method was used to bypass numerical artifacts. The simulated values show that it is possible to reduce the electric field strength by an adaption of the metallization structure. There the distance of the upper and the lower metallization to the rim of the ceramic was changed relative to each other. Due to this variation a reduction of the electric field strength of about 30% can be reached by choosing the optimum distance compared to state of the art design. In PRPD measurements for insulating ceramic substrates (AlN/Al 2 O 3 by DCB) we examined whether the electric field strength reduction leads to higher partial discharge inception voltages (PDIV). The measurements were executed on layouts with different dimensions of the upper and lower metallization relative to each other as well as for 3 different thicknesses of the ceramic insulation layer. An increase from 20% to 35% of the PDIV was measured for layouts designed according to the findings from the simulation with respect to electric field strength reduction. Finally, the calculated electric field strength and the measured PDIV were correlated.

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Section: E16-003-2mentioning

confidence: 99%

Partial Discharges in Ceramic Substrates - Correlation of Electric Field Strength Simulations with Phase Resolved Partial Discharge Measurements

Bayer

Waltrich

Soueidan

et al. 2016

Transactions of The Japan Institute of Electronics Packaging

View full text Add to dashboard Cite

show abstract

“…10). Further results on the influence of the structure or of the dielectric materials used (ceramic, potting) on the PDIV are given elsewhere [23,24]. Combining the calculated maximum electric field strength in the two measurement points of each edge the PDIV was plotted as a function of the arithmetic as well as the geometric mean ( Fig.…”

Section: Measurement Of the Pdivmentioning

confidence: 99%

“…Furthermore, the PDIV can be increased by inert fluids instead of potting like silicone gels with the same permittivity and with increased permittivity of the fluids. In addition, optimized manufacturing processes, for instance for etching or polishing, as well as a rounded shape of the metallization layout can contribute to the reduction of PD [22,23]. Many tests were done on the localization of the critical sections in the module and the electrical insulation itself.…”

Section: Introductionmentioning

confidence: 99%

Partial discharges in ceramic substrates - correlation of electric field strength simulations with phase resolved partial discharge measurements

Bayer

Waltrich

Soueidan

et al. 2016

2016 International Conference on Electronics Packaging (ICEP)

View full text Add to dashboard Cite

High voltages and the edges of the metallization on ceramic substrates (AMB, DBA, DBC, HTCC, LTCC) lead to high electric field strengths. In the vicinity of the metal edges these high electric field strengths induce partial discharges in the ceramic insulation and in the covering synthetics and thereby represent one key degradation mechanism of power modules. In this work the correlation of the simulated electric field strength with phase resolved partial discharge (PRPD) measurements has been investigated. For the simulation of the electric field strength a new method was used to bypass numerical artifacts. The simulated values showed that it is possible to reduce the electric field strength by an adaption of the metallization structure. There the distance of the upper and the lower metallization to the rim of the ceramic was changed relative to each other. Due to this variation a reduction of the electric field strength by about 30 % can be reached by choosing the optimum distance compared to state of the art modules. In PRPD measurements for ceramic substrates (AlN/Al2O3 by DCB) we examined whether the field reduction leads to higher partial discharge inception voltages (PDIV). The measurements were executed on layouts with different dimensions of the upper and lower metallization relative to each other as well as for 3 different thicknesses of the ceramic insulation (1 mm and 0.63 mm AlN DBC, 0.63 mm and 0.38 mm Al2O3 DBC) layer. An increase from 20 % to 35 % of the PDIV was measured for layouts which were designed according to the findings from the simulation with respect to field strength reduction. Finally, the calculated electric field strength and the measured PDIV were correlated

show abstract

Influence of manufacturing parameters on the PD-behaviour of AlN-substrates

Cited by 2 publications

References 0 publications

Partial Discharges in Ceramic Substrates - Correlation of Electric Field Strength Simulations with Phase Resolved Partial Discharge Measurements

Partial Discharges in Ceramic Substrates - Correlation of Electric Field Strength Simulations with Phase Resolved Partial Discharge Measurements

Partial discharges in ceramic substrates - correlation of electric field strength simulations with phase resolved partial discharge measurements

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