Influence of interfacial intermetallic compound on fracture behavior of solder joints

Lee, Hwa-Teng; Chen, Ming-Hung; Jao, Huei-Mei; Liao, Tain-Long

doi:10.1016/s0921-5093(03)00277-6

Cited by 212 publications

(101 citation statements)

References 21 publications

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“…6 Simultaneously with our investigation 17 experimental results were described by means of finite-element analysis (FEA), indicating an inverse relationship (using a power-law description) between the tensile strength and gap size. 18 Although these efforts were very successful for the description of the specific specimen under investigation, it seems useful to reintroduce some of the pre-existing models into this discussion.…”

Section: Size Effects and Dimensional Constraints The Approximation Bmentioning

confidence: 52%

“…Trends in strength reduction and fractography for Sn-Ag solders on copper substrates were found to be broadly similar for shear and tensile testing modes when taking into account the influence of intermetallic compounds. 6 However, there appears to be a large variance in the reported overall shear behavior and attention must be paid to comparison of shear results, even for identical solder compositions and substrate combinations. 9 Further studies of the microstructural features and fracture behavior are needed to clarify these results and are currently under progress.…”

Section: Shear Experimentsmentioning

confidence: 99%

“…Thus available data on bulk materials are not reliable if one considers the extremely small solder volumes (<10 -12 m 3 ) in modern microelectronic devices. Several investigations have been conducted on the thermomechanical integrity and reliability of solder joints, also with respect to specimen size, 2-4 the influence of rather brittle intermetallic compounds (IMCs) (such as Cu 3 Sn and Cu 6 Sn 5 ), on the strength 5,6 or the tensile fracture of solder joints 7 as well as deformation characteristics of solder joints during shear loading. 8 Nevertheless, very few systematic experimental studies on the effect of the reduced solder size and geometry on the mechanical performance are available in the literature.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Mechanical Size Effects in Miniaturized Lead-Free Solder Joints

Zimprich

Saeed

Betzwar-Kotas

et al. 2007

Journal of Elec Materi

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Future reliability and quality control of microelectronics will greatly depend on a detailed understanding of the complex mechanical and thermal properties of miniaturized lead-free solder joints. Therefore, the question of the occurrence of size effects or dimensionally induced constraints, which could change the mechanical properties of solder joints in small dimensions dramatically, has become the focus of investigation. In this study we investigated the influence of decreasing gap size on the tensile, shear, and stress relaxation behavior of solder joints to investigate the occurrence of size effects and dimensionally induced constraints, which could change the mechanical properties of solder joints significantly in micrometer dimensions. Residual stresses might remain in the solder joints during high-temperature dwell in thermomechanical fatigue. Model solder joints (Sn3.5Ag/Cu) of rectangular shape with gap sizes varying between 25 lm and 850 lm were prepared by reflow soldering to achieve near-industrial soldering processing. Scanning electron microscopy was used for analyzing the microstructure and the complex modes of fracture and crack propagation in the solder interconnect. The observed tensile behavior can be interpreted in terms of an existing theory for brazed joints to complement finite-element analysis that is usually used for a description of these phenomena.

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Section: Size Effects and Dimensional Constraints The Approximation Bmentioning

confidence: 52%

Section: Shear Experimentsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Mechanical Size Effects in Miniaturized Lead-Free Solder Joints

Zimprich

Saeed

Betzwar-Kotas

et al. 2007

Journal of Elec Materi

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show abstract

“…These hard and brittle Cu 3 Sn particles are normally alternated with the Bi-rich phase permitting the eutectic mixture to be characterized. According to Figure 4, The primary Cu 3 Sn intermetallic phases with a thickness about 4 µm were surrounded by Cu 6 Sn 5 intermetallic phases for lowest solidification rate (8.3 µm/s) and these two , Le et al 47 and Rao et al…”

Section: Effect Of Solidification Rate On Microstructurementioning

confidence: 97%

Microstructural evolution and mechanical properties of Sn-Bi-Cu ternary eutectic alloy produced by directional solidification

2018

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Sn-36Bi-22Cu (wt.%) ternary eutectic alloy was prepared using vacuum melting furnace and casting furnace. The samples were directionally solidified upwards solidification rate varying from 8.3 to 166 µm/s and at a constant temperature gradient (4.2 K/mm) in a Bridgman-type directional solidification furnace. The composition analysis of the phases and the intermetallics (Cu 3 Sn and Cu 6 Sn 5 ) were determined from EDX and XRD analysis respectively. The variation of the lamellar spacing (Bi-rich phase) and the Cu 3 Sn phase spacing with the solidification rate were investigated. The dependence of microhardness, ultimate compressive strength and compressive yield strength on solidification rate were determined. The spacing and microhardness were measured from both longitudinal and transverse sections of the samples. The dependence of microhardness on the lamellar spacing and the Cu 3 Sn phase spacing were also determined. The relationships between phase spacings, solidification rate and mechanical properties were determined from linear regression analysis.

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“…Since Sn is the major component of lead-free solder alloys that takes part in normal interfacial reaction, the high-tin-content solder has a much stronger reaction with metallic substrate or under bump metallization (UBM) than the eutectic Sn-Pb solder in terms of the formation and growth of intermetallic compounds (IMC) at the interface of solder/substrate(UBM). Many studies indicated that the morphology and thickness of the interfacial IMC in solder interconnects have a significant influence on the mechanical properties of solder joints [3][4][5][6]. The interfacial IMC shows an intrinsic brittleness greatly different from the ductile solder and substrate (or UBM) materials.…”

Section: Introductionmentioning

confidence: 99%

Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process

Zhou

Zhang

2012

J Mater Sci: Mater Electron

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The early interfacial reaction and premelting characteristics of the Sn/Cu and Sn/Ag soldering systems, and the formation and morphology transition of interfacial intermetallic compounds in the two systems during the reflow soldering process were investigated by using a differential scanning calorimeter. Results show that the initial interfacial eutectic reaction arising from atomic interdiffusion in solid-state Sn/Cu and Sn/Ag systems results in the premelting at each interface of the two systems at a temperature 4.9 and 10.6°C respectively lower than the actual melting point of pure tin, and consequently both of the Sn/Cu and Sn/Ag soldering systems exhibit morphology change of the intermetallic compound (IMC) as the solder experiences a transition from solid-state to liquid-state in a very small temperature range. The change in the interfacial energy between the solid (or liquid) Sn-rich phase and IMC phase is the essential factor leading to the morphology transition of the interfacial IMC in the Sn/Cu and Sn/Ag soldering systems.

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Influence of interfacial intermetallic compound on fracture behavior of solder joints

Cited by 212 publications

References 21 publications

Mechanical Size Effects in Miniaturized Lead-Free Solder Joints

Mechanical Size Effects in Miniaturized Lead-Free Solder Joints

Microstructural evolution and mechanical properties of Sn-Bi-Cu ternary eutectic alloy produced by directional solidification

Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process

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