Influence of indium addition on structure, mechanical, thermal and electrical properties of tin–antimony based metallic alloys quenched from melt

Shalaby, Rizk Mostafa

doi:10.1016/j.jallcom.2009.02.013

Cited by 33 publications

(20 citation statements)

References 12 publications

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“…It is found that the tensile fracture strength, compressive yield strength increasing with the addition of In, Bi or Zn. This may be due to high performance metal alloys are never single phase but generally consists of a matrix interspersed by areas of an intermetallic phases as Ag 3 Sn, Ag 0.8 Sn 0.2 and AgZn [19].…”

Section: Internal Friction and Dynamic Young's Modulusmentioning

confidence: 99%

Effect of rapid solidification on mechanical properties of a lead free Sn–3.5Ag solder

Shalaby

2010

Journal of Alloys and Compounds

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Section: Internal Friction and Dynamic Young's Modulusmentioning

confidence: 99%

Effect of rapid solidification on mechanical properties of a lead free Sn–3.5Ag solder

Shalaby

2010

Journal of Alloys and Compounds

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“…The near peritectic Sn-5Sb Pb-free solder alloy has received considerable attention for high temperature electronic applications, especially on step soldering technology, flip-chip connection [2][3][4], solder ball connections and bonding a semiconductor device onto a substrate. It also has proposed as cathode materials for use in lithium ion batteries [5,6].…”

Section: Introductionmentioning

confidence: 99%

Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu

El-Daly

Fawzy

Mohamad

et al. 2011

Journal of Alloys and Compounds

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“…However, in view of increasing environmental and health concerns, alternative solder alloy systems need to be considered. For electronic parts and devices, solder joints provide electrical conductivity and suitable mechanical strength [8,9]. So that the aim of the present work to study the effect of indium additions and rapid solidification on the structure, melting temperature, microhardness and micro-creep of Sn-Zn eutectic lead free solder alloy.…”

Section: Introductionmentioning

confidence: 99%

Effect of indium content and rapid solidification on microhardness and micro‐creep of Sn‐Zn eutectic lead free solder alloy

Shalaby¹

2010

Cryst. Res. Technol.

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The Sn-Zn alloys have been considered as lead-free solders. In this paper, the effect of 0.0, 0.5, 1.0, 1.5 and 2.0 wt.% Indium as ternary additions on melting temperature, structure, microhardness and micro-creep of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Indium to the Sn-Zn binary system result in a suppression of the melting point to 187.9 °C. From x-ray diffraction analysis, a new intermetallic compound phase, designated β-In 3 Sn is detected. The formation of an intermetallic compound phase causes a pronounced increase in the electrical resistivity and mechanical strength. Also, an interesting connection between dynamic Young's modulus and the axial ratio (c/a) of the unit cell of the β-Sn was found in which Young's modulus increases with increasing the axial ratio (c/a). The ternary Sn-9Zn-xIn exhibits creep resistance superior to Sn-9Zn binary alloy. The better creep resistance of the ternary alloy is attributed to solid solution effect and precipitation of In 3 Sn in the Sn matrix. The addition of small amounts of In is found to refine the effective grain size and consequently, improves hardness. The 89%Sn-9%Zn-2%In alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.

show abstract

Influence of indium addition on structure, mechanical, thermal and electrical properties of tin–antimony based metallic alloys quenched from melt

Cited by 33 publications

References 12 publications

Effect of rapid solidification on mechanical properties of a lead free Sn–3.5Ag solder

Effect of rapid solidification on mechanical properties of a lead free Sn–3.5Ag solder

Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu

Effect of indium content and rapid solidification on microhardness and micro‐creep of Sn‐Zn eutectic lead free solder alloy

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