Influence of ground plane width on reduction of radiated emission from printed circuit boards

Oka, Naoto; Miyazaki, Chiharu; Uchida, Tatsuo; Nitta, S.

doi:10.1002/1520-6432(200101)84:1<21::aid-ecjb3>3.0.co;2-p

Cited by 6 publications

(3 citation statements)

References 13 publications

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“…The extent of uni-directional modal current nature decreases in CMSA and further in ETMSA designs. Another factor that adds to the back lobe radiation is the common mode current excitation [29,30]. The common mode current arises due to the imperfections in the antenna design with respect to the feed.…”

Section: Regular Shape Msas Using H-shape Ground Planementioning

confidence: 99%

Wideband Designs of Regular Shape Microstrip Antennas Using Modified Ground Plane

Chavali¹,

Deshmukh²

2021

PIER C

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Wideband designs of proximity fed regular shape microstrip antennas using bow-tie and H-shape ground plane profiles are proposed in the 1000 MHz frequency range. The modified ground plane alters the quality factor of the patch cavity which enhances the impedance bandwidth. In terms of the results obtained for the bandwidth and gain together, circular and square patches backed by bow-tie shape ground plane, followed by circular patch backed by H-shape ground plane yield optimum results. For substrate thickness of 0.097λ g , against the conventional ground plane, bow-tie shape gives 12% and 24% bandwidth increment for the circular and square patches, respectively, and H-shape ground plane yields bandwidth increment by 17% in the circular patch. All these wideband designs offer a peak gain around 6 dBi with a broadside radiation pattern. Further, a modified ground plane profile helps in optimizing the proximity fed antennas on lower substrate thicknesses. Amongst all the configurations, for ∼ 0.03λ g reduction in the substrate thickness, square microstrip antenna using bow-tie shape ground plane yields 19% increase in the impedance bandwidth against the equivalent thicker substrate design with a peak broadside gain of above 6 dBi. Thus, the proposed modified ground plane antennas yield bandwidth improvement but for a smaller substrate thickness.

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Section: Regular Shape Msas Using H-shape Ground Planementioning

confidence: 99%

Wideband Designs of Regular Shape Microstrip Antennas Using Modified Ground Plane

Chavali¹,

Deshmukh²

2021

PIER C

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“…3. The radiation produced in the distance R by the common mode current I Common(k) on the k-th line part is represented as the following equations by using a vector potential A k and an alley factor of an image current Fa k [7]. The radiated electric fields E θk and E φk are superposed at the observation point.…”

Section: Radiated Emissionmentioning

confidence: 99%

Degree of Unbalance About Earth and Radiated Emission of Differential Type Microstrip Line in GHz Band

Shiota

Matsubara

Miyazaki

et al. 2007

2007 IEEE International Symposium on Electromagnetic Compatibility

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Balance-unbalance conversion factors and radiated emissions from differential type microstrip lines (DML) have not been examined in the frequency range above 1 GHz, because it is difficult to obtain the balun that can be used in GHz band. In this paper, we tried to measure them in the frequency range above 1 GHz by using mode analysis function of a network analyzer instead of balun, and compare with the calculation values by using the 4-terminal pair networks chain matrix theory. As their results, it was confirmed that this calculation method is effective in the frequency range above 1 GHz.

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“…Thus the microstrip smc-!me needs the wide ground pattem for signal integrity and EMI. When signal traces are routed in the vicinity of 0-7803-7264-6/02/$17.00 0 2002 IEEE 113 ground plane edge or run on a narrow ground plane, it makes common mode radiation [4,6]. For a PCB with narrow ground pattem, we presented another common-mode generation scheme in [8] by using a parameter named 'current division factor' [7].…”

Section: Introductionmentioning

confidence: 99%

Estimation of common-mode EMI caused by a signal line in the vicinity of ground edge on a PCB

Watanabe

Wada

Toyota

et al.

IEEE International Symposium on Electromagnetic Compatibility

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The authors have developed an estimation method of common mode radiationfiom a PCB. A parameter named 'current division factor' explains a generation mechanism of the common mode. Rigorous analysis, instead of rough approximation, is required to calculate the factor for an asymmetric structure. A 2-dimentional static electric field analysis by the boundary element method (BEM is applied to this calculation, which requires less time than 3-dimentional simulations. E M increases when the signal line comes close to the edge ofgroundpattern. The effect is evaluated with the simulation of the factor. The estimation agrees well with measurement within I dB.

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Influence of ground plane width on reduction of radiated emission from printed circuit boards

Cited by 6 publications

References 13 publications

Wideband Designs of Regular Shape Microstrip Antennas Using Modified Ground Plane

Wideband Designs of Regular Shape Microstrip Antennas Using Modified Ground Plane

Degree of Unbalance About Earth and Radiated Emission of Differential Type Microstrip Line in GHz Band

Estimation of common-mode EMI caused by a signal line in the vicinity of ground edge on a PCB

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