Influence of glass substrate thickness in laser scribing of glass

Yamamoto, Koji; Hasaka, Noboru; Morita, Hideki; Ohmura, Etsuji

doi:10.1016/j.precisioneng.2009.03.007

Cited by 15 publications

(7 citation statements)

References 4 publications

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“…A high-quality cutting surface is not easily achievable. Various machining processes, such as a mechanical tool bit [5][6][7], a water jet [8,9], chemical etching [10,11], and a laser beam [12][13][14][15][16][17][18][19][20], have been used for this purpose. One of most popular techniques for cutting glass is the conventional mechanical process involving the physical contact of tool bits.…”

Section: Introductionmentioning

confidence: 99%

Thermal cleavage on glass by a laser-induced plume

Choi

Kim

2014

Optics and Lasers in Engineering

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Section: Introductionmentioning

confidence: 99%

Thermal cleavage on glass by a laser-induced plume

Choi

Kim

2014

Optics and Lasers in Engineering

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“…A process combining laser heating and water cooling was even used to cut glass substrate [17]. While scanning, the laser beam is followed by a water jet.…”

Section: Example Of Nonablative Processmentioning

confidence: 99%

“…A crack is generated at the concordance point between the tensile stresses (laser heating) and compressive stresses (water cooling) acting in opposite directions (Figure 3). Laser-material interaction and the crack propagation are analyzed according to thermal stresses generation through numerical simulation in this article [17]. This process results in a clean chipping-free edge.…”

Section: Example Of Nonablative Processmentioning

confidence: 99%

Numerical Simulation of Laser Processing Materials: An Engineering Approach

Savriama¹,

Semmar²

2016

Modeling and Simulation in Engineering Sciences

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The following chapter aims at giving an overview of the use of numerical simulation in the field of laser processing. Indeed, the past two decades saw an increasing demand for lasers in various areas such as healthcare, microelectronics, cartography, optoelectronics, aeronautics, etc. Thus, the comprehension of the laser-material interaction and the removal mechanism became primordial to predict and improve the efficiency of a process. After a nonexhaustive literature review, two simulation approaches (Finite Element and Design Of Experiment, DOE) will be presented to demonstrate the importance of numerical simulation in laser applications. process, numerical simulation can give an insight of what is happening inside the workpiece, which is delicate by experimental means.Multiphysics packages such as ANSYS, ABAQUS, ADINA, or COMSOL are effective for the aforementioned issue and for fundamental investigation. In the industry, another semiempirical modeling method is useful when direct answers are expected regarding parameters optimization, predicting the system behavior or analyzing the effect of a modification. The Design Of Experiment (DOE) methodology shows its efficiency especially when the experimental investigation suffers from constraints such as the availability of the device, the experimenter, the material, the risks, the costs, or the environment.Although nonexhaustive, a list of laser applications and how they were modeled will be presented in the following parts. Multiphysics models will be presented first, followed by the DOE approach. A laser application will be discussed for both types of numerical simulations. Multiphysics simulation of laser processingModeling and Simulation in Engineering Sciences 162

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“…유리는 취성재료로서 크랙 전파가 임의의 방향으로 진행되어 유 리의 절단기술은 매우 흥미로운 주제다 [1] . 이 유리절단 방법에는 다이아몬드툴 같은 공구를 사용하는 기계적인 방법 [4][5][6] , 워터젯을 이용한 방법 [7,8] , 화학 에칭방법 [9,10] 그리고 레이저를 이용한 레이 저 절단방법 등이 있다 [11][12][13][14][15][16][17][18][19] . 현재 상용화된 방법은 기계적 절단 방법으로 절단날을 사용하는 연삭절단 방법과 다이아몬드 스크라 이빙 휠을 이용한 굽힘절단 방법이 있다 [20] .…”

Section: 서 론unclassified

The Fracture Effect of a Non-Symmetric Laser Beam on Glass Cutting

Yoon¹,

Kim²

2015

Journal of The Korean Society of Manufacturing Technology Engin

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Article history:A non-symmetric laser beam was used for cutting a thin glass substrate and its effect was investigated. In laser cutting of brittle materials, controlling crack initiation on the surface is crucial; however, it is difficult to ensure that crack propagation occurs according to a designed laser path. A lot of deviation in crack propagation, especially at the edge of the substrate, is usually observed. A non-symmetric laser beam generates a non-uniform energy distribution, which enhances directional crack propagation. A 20-W pulsed YAG laser was used for cutting a thin glass substrate. Parametric analysis was carried out and the crack control of the non-symmetric laser beam was improved. A theoretical model was presented and the limitations of the proposed process were also discussed. . 이 유리절단 방법에는 다이아몬드툴 같은 공구를 사용하는 기계적인 방법 [4][5][6] , 워터젯을 이용한 방법 [7,8] , 화학 에칭방법 [9,10] 그리고 레이저를 이용한 레이 저 절단방법 등이 있다 [11][12][13][14][15][16][17][18][19] . 현재 상용화된 방법은 기계적 절단 방법으로 절단날을 사용하는 연삭절단 방법과 다이아몬드 스크라 이빙 휠을 이용한 굽힘절단 방법이 있다 [20] . 그러나 이런 기계적인 절단 방식은 절단 시 유리에 발생한 마이크로 크랙이 미세한 손상을 초래하며, 이 손상은 마이크로 입자 를 발생시킨다 [20][21][22] . [20,[22][23][24] .

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Influence of glass substrate thickness in laser scribing of glass

Cited by 15 publications

References 4 publications

Thermal cleavage on glass by a laser-induced plume

Thermal cleavage on glass by a laser-induced plume

Numerical Simulation of Laser Processing Materials: An Engineering Approach

The Fracture Effect of a Non-Symmetric Laser Beam on Glass Cutting

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