Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5Sn–3.5Ag

Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen

“…The exponent for all condition is about 0.5, which is similar to that measured in large bulk specimen of Sn-Ag solders. [6][7][8][9][10][11][12] As can be seen in Fig. 7, the fatigue life of the alloy is sensitive Isothermal…”

“…Therefore, the low cycle fatigue test should also be performed using micro size specimen. A number of studies on low cycle fatigue of solder alloys were reported to date, [7][8][9][10][11][12][13][14] whereas there are no studies on that using small volume specimen.…”

Acoustic Microscopy of Interfacial Crack in Sn-Ag-Cu Alloy Solder Joints under Shear Fatigue Testing

“…When electronic devices are installed in machineries, such as automobiles, these devices suffer repeated loading and thermal cycling to cause degradation of the solder joints, and finally to result in failure. To prevent catastrophic failures, lots of studies have been carried out on the fatigue and thermo-mechanical fatigue behaviors of the lead-free solder [1][2][3][4][5][6][7][8][9][10][11][12][13] and solder joints. [14][15][16][17][18][19][20] Development of electronic devices accelerates downsizing of the solder joints, and currently grid arrays of a solder ball of about 100 mm in diameter are used in electronic devices.…”

Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing

“…5,6) Although many Pb-free solders have been proposed, there are no obvious replacements for the Sn-37Pb which is most common in electronics. Many Pb-free solders such as Sn-Ag-Cu, Sn-Ag, and Sn-Ag-Bi have been in use for years.…”