Influence of Experimental Setup and Plastic Deformation on the Shaft-Loaded Blister Test

O'Brien, Emmett P.; Goldfarb, Stephanie; White, Christopher C.

doi:10.1080/00218460590954601

Cited by 10 publications

(7 citation statements)

References 30 publications

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“…Since equation (2) uses both the measured displacement and load, the in-elastic localized deformation of the coating near the loading shaft tip might have been incorporated into the measured displacement, which should be larger than the linear elastic deformation used in equation (10), and thus results in larger G T for circular plate with a small radius. This is consistent with the finding by O'Brien et al who reported that when displacement variable was incorporated in the calculation increased blister height resulting from plastic deformation led to G T values as high as a factor of 4 compared to load-based equation where displacement was not incorporated [15]. Also as reported in Wang and Tong…”

Section: Energy Release Ratessupporting

confidence: 93%

“…The expected trend of the increased displacement with the decrease of the shaft diameter for a given initial debonding radius was observed in the current study presumably due to increased plastic deformation at the shaft-coating contact zone as reported by [15].…”

Section: Debonding Radii Loads and Displacementssupporting

confidence: 63%

“…The increase was higher for the shaft of smaller diameter than the shaft of larger diameter. Although unaffected load and debonding radius with the variation of shaft-tip diameter has been reported by O'Brien et al [15]. They have reported that the load-based equation was independent of the plastic deformation at the shaftpolymer film contact area.…”

Section: Debonding Radii Loads and Displacementsmentioning

confidence: 85%

See 2 more Smart Citations

Effects of initial blister radius and shaft diameter on energy release rate of metal–polymer composite coating

Islam

Tong

2015

International Journal of Adhesion and Adhesives

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Section: Energy Release Ratessupporting

confidence: 93%

Section: Debonding Radii Loads and Displacementssupporting

confidence: 63%

Section: Debonding Radii Loads and Displacementsmentioning

confidence: 85%

See 1 more Smart Citation

Effects of initial blister radius and shaft diameter on energy release rate of metal–polymer composite coating

Islam

Tong

2015

International Journal of Adhesion and Adhesives

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“…Previous work suggested that the load-based equation is the preferred expression to calculate G due to the reduced effects of plastic deformation at the contact area and the insensitivity to changes in mechanical properties of the film [16,24] due to plasticization by fluid absorption. [23] However, in the presence of the slip-stick failure as observed for these samples, the displacement-based is the most appropriate expression to calculate G. Specimens were tested using loading and unloading cycles, which were repeated multiple times, to determine the crack length as a function of load and displacement (blister height).…”

Section: Methodsmentioning

confidence: 99%

“…NR has been used to quantify the moisture content at the polymer/substrate interface for a series of substrate surfaces. The shaft-loaded blister test (SLBT) has been utilized to measure adhesion [16][17][18][19][20][21][22][23][24] and mechanical properties of the adhered thin films. [16,20,[25][26][27][28][29][30] Using neutron reflectivity and SLBT adhesion measurements, we investigate how surface chemistry influences the water content near the interface and the adhesive fracture energy after attaining an apparent equilibrium in either the dry (0 % relative humidity (rh.)…”

mentioning

confidence: 99%

Correlating Interfacial Moisture Content and Adhesive Fracture Energy of Polymer Coatings on Different Surfaces

2006

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Sn-Ag-Cu alloy. The Sn-Ag-Cu-Ge alloy solder ball had higher ball shear strength than the Sn-Ag-Cu alloy after an aging test at 150°C. The Sn-Ag-Cu-Ge alloy solder has better characteristics for both thermal oxidation and thermal reliability test. Therefore, it can be concluded that the Sn-Ag-Cu-Ge alloy is a good candidate to solve the oxidation problem, which is the most critical problem of the Pb-free solder. ExperimentalTwo solder ball compositions (in wt%) chosen in this study were : Sn3.0Ag0.5Cu and Sn3.0Ag0.5Cu0.05Ge, and had a diameter of 0.450 mm. The substrate used was CSP with 144 pad openings and each pad was 0.38 mm in diameter. The pads had an electroplated Ni/Au surface finish over Cu trace, with about 0.5 and 5.0 lm in thickness respectively. The solder balls from each composition were bonded to the CSP substrate using a water soluble flux under a reflow oven. The reflow condition is that preheating was done for 2 min at 150°C, the peak temperature was 235°C, and the dwell time was 60 sec.The solder balls after one were then analyzed or subjected to either multiple reflow up to 5 times or aging at 150°C for a duration up to 500 hs. XPS was utilized to check the oxide layer thickness and examine the surface chemical composition. We assumed that the oxide thickness can be defined by oxygen concentration under three atomic percent. The mechanical joint strength of the bonded balls was evaluated with Dage shear tester using a shear speed of 200 lm/s at a shear height of 10 lm.It is well known that ambient moisture and other environmental influences are detrimental to the adhesion of polymeric materials to metal surfaces. The primary reason why adhesion loss occurs is believed to be due to moisture accumulation at the polymer/metal interface. This is why adhesion loss does not generally correlate with the bulk moisture content of the polymer. In this work, we present measurements of the interfacial moisture content and adhesion for a series of polymer coatings having different surface chemistries. Measurements were made after reaching an apparent equilibrium in either a dry (0 % relative humidity) or wet (100 % relative humidity) environment. The loss of adhesion is found to correlate directly with interfacial water content. Surface treatments that resulted in a more hydrophilic surface lead to an increase in the interfacial water content and a decrease in interfacial fracture energy.Ambient moisture is well known to adversely affect the durability and performance of adhesive joints and coatings. [1] The interplay between the mechanical stress and chemical changes in the adhesive joint due to moisture adsorption is generally believed to be the root cause of failure of the adhesive application. Failure typically occurs at the polymer/metal interface, indicating that the primary mechanism for failure is not degradation of the bulk polymer. Instead, the structure of the coating near the interface is the determining factor in COMMUNICATIONS 114

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Testing Adhesive Joints

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Influence of Experimental Setup and Plastic Deformation on the Shaft-Loaded Blister Test

Cited by 10 publications

References 30 publications

Effects of initial blister radius and shaft diameter on energy release rate of metal–polymer composite coating

Effects of initial blister radius and shaft diameter on energy release rate of metal–polymer composite coating

Correlating Interfacial Moisture Content and Adhesive Fracture Energy of Polymer Coatings on Different Surfaces

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