Influence of Cu columns on current crowding effect in electromigration in flip-chip solder joints

Liang, Yuhao; Tsao, W. A.; Yao, Da‐Jeng; Lai, Yi‐Shao; Chen, Chih

doi:10.1109/eptc.2011.6184535

2011 IEEE 13th Electronics Packaging Technology Conference 2011

DOI: 10.1109/eptc.2011.6184535

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Influence of Cu columns on current crowding effect in electromigration in flip-chip solder joints

Yuhao Liang

W. A. Tsao

Da‐Jeng Yao

et al.

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Influence of Cu columns on current crowding effect in electromigration in flip-chip solder joints

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References 12 publications

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