Appl Adhes Sci
 2015
DOI: 10.1186/s40563-015-0040-6
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Influence of copper layer on epoxy acrylate based solder mask surface chemistry and the effect on epoxy adhesion

Caroline Hofmeister
1
,
Susanne Maaß
2
,
T. Fladung
3
et al.
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Cited by 7 publications
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References 16 publications
(23 reference statements)
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Characterization of Commercial Solder Mask in Printed Circuit Board Application

Lim1,
Jaafar2,
Ishak3
et al. 2023
Springer Proceedings in Materials
1
0
0
0
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Characterization of Commercial Solder Mask in Printed Circuit Board Application

Lim1,
Jaafar2,
Ishak3
et al. 2023
Springer Proceedings in Materials
1
0
0
0
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Recent developments in advanced polymeric materials for solder mask application: Progress and challenges

Lim
1
,
Jaafar
2
,
Ishak
3
et al. 2023
Journal of Science: Advanced Materials and Devices
3
0
1
0
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Evaluation of process influences on surface chemistry of epoxy acrylate based solder mask via XPS, ToF-SIMS and contact angle measurement

Hofmeister
1
,
Maaß
2
,
Fladung
3
et al. 2017
Materials Chemistry and Physics
4
0
3
0
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