Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties

Tu, Xiaoxuan; Yi, Danqing; Wu, Jing; Wang, Bin

doi:10.1016/j.jallcom.2016.12.191

Cited by 49 publications

(26 citation statements)

References 30 publications

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“…Their study showed that the activation energy for the growth of IMCs was higher for Ce based SAC which was responsible for reducing the growth of IMCs and increasing the strength of the solder joint. Furthermore, (Tu et al, 2017) have reported that 0.15 wt% of Ce addition into SAC improved microstructure by reducing the thickness of the IMCs. (Zhang et al, 2014) have recommended that additions of 0.05 wt% of Ytterbium (Yb) in SAC improves the properties of SAC in electronic packaging and refines the microstructure by retarding the growth of IMCs during soldering.…”

Section: Microstructurementioning

confidence: 99%

“…Similarly, (Zhang et al, 2014) reported that inclusions of 0.05 wt% Yb to the SAC increase the tensile force of SAC solder joint by 25.4%. (Tu et al, 2017) (Tu et al, 2017) ( Tsao et al, 2013) concluded that the addition of 1 wt% of Al 2 O 3 nanoparticles increased the shear strength of SAC after 1 cycle and 8 cycles of reflow by 14.4% and 16.5%, respectively. (Tang et al, 2014) added different compositions of TiO 2 nanoparticles into SAC which improved the mechanical properties at 0.1 wt% of TiO 2 nanoparticles into SAC.…”

Section: Mechanical Propertiesmentioning

confidence: 99%

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A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Aamir

Muhammad

Tolouei‐Rad

et al. 2019

SSMT

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Purpose The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series. Design/methodology/approach The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets. Findings The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.

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Section: Microstructurementioning

confidence: 99%

Section: Mechanical Propertiesmentioning

confidence: 99%

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Aamir

Muhammad

Tolouei‐Rad

et al. 2019

SSMT

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show abstract

“…These problems are mainly focus on the IMCs in solder joints [6], and the brittle IMCs reduce strength of solder joints and produce Kirkendall voids [7]. The overgrowth of IMCs layer is effectively controlled by adding the appropriate alloying elements, such as Mn [8], Ni [9], Ce [10], Pr [11], Fe [12], Bi [13], Sb [14], In [15], Ag [16], Zn [17] and other nano-scale oxide particles [18,19].…”

Section: Introductionmentioning

confidence: 99%

Investigation of Cu particles size and bonding time on the microstructure and shear property of Cu/In-45Cu/Cu solder joints

Wang²,

Xiong

et al. 2020

Mater. Res. Express

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The effect of Cu particles size and bonding time on the microstructure and shear property of Cu/In-45Cu/Cu solder joint was studied, and the shedding mechanism of intermetallic compounds (IMCs) in the solder joint during transient liquid phase (TLP) bonding process was investigated. The results showed that the microstructure of Cu/In-45Cu/Cu solder joint was composed of Cu 11 In 9 phase, residual In phase and Cu particles, and the microstructure of solder joints prepared by small Cu particles was dense. The content of IMCs was increased with increasing bonding time, and the Cu/In-45Cu/Cu solder joint was composed of Cu 11 In 9 phase and Cu particles under bonding time 30 min. The Cu 2 In phase was formed in the solder joint at 60 min, and many cracks appeared at the interface of Cu 11 In 9 and Cu 2 In phases. The shear strength of Cu/In-45/Cu solder joints with brittle fracture was increased firstly and then decreased with increasing bonding time, and the maximum shear strength of the solder joint was 16.35 MPa at 30 min.

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“…Currently, the researches on SAC305 solder mainly concentrate on microstructure, the growth kinetics of intermetallic compounds (IMCs) and the improvement of mechanical properties of joints [9][10][11][12]. Shen et al [13] investigated the microstructure evolution and growth mechanism of the interfacial IMCs during the solid-state aging process.…”

Section: Introductionmentioning

confidence: 99%

Comparative Study on Solid-State and Metastable Liquid-State Aging for SAC305/Cu Joints

Zhang

et al. 2018

Acta Metall. Sin. (Engl. Lett.)

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In order to study the influence of the physical state of solder on the interfacial reaction of dip-soldered Sn-3.0Ag-0.5Cu/Cu system, two kinds of experiments were designed, including: (1) solid-state aging between the solder and Cu substrate; (2) liquid-state aging between the metastable supercooled liquid-state solder and Cu substrate. The aging times were 30, 60, 120 and 180 min, respectively, and the aging temperature was 8°C lower than the melting point of the Sn-3.0Ag-0.5Cu (SAC305) alloy (217°C). The experimental data revealed that the physical state of the solder obviously affected the formation of the intermetallic compound (IMC), and resulted in the difference in the diffusion of atoms on the interface between the SAC305 solder and Cu substrate. The IMC interface after aging for 30 min presents unique characteristics compared with that of the sample after dip soldering. The IMC interface of solid-state aged SAC305/Cu couple is relatively planar, while the IMC interface under metastable supercooled liquid-state aging conditions presents scallop-like shape.

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Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties

Cited by 49 publications

References 30 publications

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Investigation of Cu particles size and bonding time on the microstructure and shear property of Cu/In-45Cu/Cu solder joints

Comparative Study on Solid-State and Metastable Liquid-State Aging for SAC305/Cu Joints

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