“…However, it is difficult to produce a β-Ga 2 O 3 wafer with a diameter large enough for practical application due to easy formation of cleavages such that the wafer size is limited to four inches [ 9 ]. Recently, mist chemical vapor deposition (Mist-CVD) has been introduced as a non-vacuum solution-process heteroepitaxy for α-Ga 2 O 3 on mass-produced sapphire (Al 2 O 3 ) wafers up to six inches, with a similar a crystal structure to α-Ga 2 O 3 [ 10 , 11 , 12 , 13 , 14 ]. Being able to lift α-Ga 2 O 3 off of the sapphire substrate and bond it to other substrates with high thermal conductivity (such as SiC, AlN, diamond, etc.)…”