Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder

Influence of Bi additions on the distinct βSn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0–4wt%)

“…We investigated additions up to 4wt%Bi as these amounts were reported to cause positive effects (i.e. improvement of mechanical properties in SAC solders [1][2][3][4]). The upper row of IPF EBSD maps in Fig.3 illustrates Sn-0.7Cu-0.05Ni alloy with no Bi.…”

“…Firstly, and most importantly it has been demonstrated that Bi additions to Sn-Ag-Cu (SAC) alloys significantly improve their mechanical performance increasing solder joint shear strength [1][2][3][4], thermal fatigue resistance [5] and improving the dropimpact performance [5]. Secondly, Bi additions are shown to improve wetting and spreading performance of lead-free soldering alloys [3,5,6] and to lower their liquidus temperature [7].…”

Effect of Ga on the Inoxidizability and Wettability of Sn-0.5Ag-0.7Cu-0.05Pr Solder

“…Therefore, it is necessary to explore the Sn-Ag-Cu leadfree solder with low-Ag content. However, with the reduction of Ag content, the properties such as wetting behavior and thermal fatigue performance become worse [2][3][4][5].…”

Reliability Analysis of Low-Silver Bga Solder Joints Using Four Failure Criteria

“…These include to lower the solidus temperature, improve the strength of the solder, and to improve wetting and spread of the solder alloy [29]- [31]. However, the effect of Bi addition to SAC solder alloys on drop shock performance is inconclusive, but may improve or decrease drop shock performance depending on the alloy composition.…”

“…The response variables were Weibull characteristic life (α) and slope (β). Significant factors were identified using a p-value 31 approach. Further, a Tukey's test of multiple comparisons was conducted for significant factors.…”