2008
DOI: 10.1109/ted.2007.914830
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Influence of Bandstructure and Channel Structure on the Inversion Layer Capacitance of Silicon and GaAs MOSFETs

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Cited by 43 publications
(17 citation statements)
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“…The ON-current variation with width- [1][2][3][4][5][6][7][8][9][10] This is an observation also noted in [7] and [30], when comparing channels of materials with different quantum capacitance (C Q ). In these works, it was shown that in channels with bias dependent quantum wells, differences in C Q are smeared out and create much less differences in the total gate capacitance and the inversion layer charge of the device.…”
Section: Implications On the On-current Variations With Size Variationsmentioning
confidence: 95%
“…The ON-current variation with width- [1][2][3][4][5][6][7][8][9][10] This is an observation also noted in [7] and [30], when comparing channels of materials with different quantum capacitance (C Q ). In these works, it was shown that in channels with bias dependent quantum wells, differences in C Q are smeared out and create much less differences in the total gate capacitance and the inversion layer charge of the device.…”
Section: Implications On the On-current Variations With Size Variationsmentioning
confidence: 95%
“…However, in nanoscale devices, as the oxide thickness approaches the nanometer regime, the oxide capacitance C ox becomes comparable to the inversion layer capacitance C inv which means that the quantum capacitance C Q and the centroid capacitance C cent start to affect the gate capacitance [8]. The centroid capacitance C cent is related to the average physical distance of the electrons present in the quantum well/2DEG from the metal gate [2]. In the case of AlInN/GaN MOSHEMT, the carriers are confined better in the 2DEG and all charge carriers are assumed to be located at the same position inside the quantum well and hence the centroid capacitance C cent can be neglected.…”
Section: Quantum Capacitance In Heterostructuresmentioning
confidence: 99%
“…GaN-based high electron mobility transitors (HEMTs) are the most preferred devices for high-power and high-frequency applications due to their suitable material properties such as high breakdown voltage, high saturation velocity, low effective mass, high thermal conductivity and high two-dimensional electron gas (2DEG) density of the order of 10 13 cm −2 at the heterointerface [1][2][3][4].…”
Section: Introductionmentioning
confidence: 99%
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“…As a consequence, the ideal capacitance-voltage (CV) characteristic of III-V metaloxide-semiconductor (MOS) structures can deviate considerably from the well established CV characteristic of silicon MOS structures. [3][4][5][6][7] Knowledge of the ideal III-V MOS CV characteristic is essential, as it is required when assessing the impact of interface defects on the experimental CV responses of real III-V MOS systems. 8,9 In this letter, we extend on the work reported in Ref.…”
mentioning
confidence: 99%