Influence of additives on the electrodeposition of zinc from a deep eutectic solvent

Alesary, Hasan F.; Cihangir, Salih; Ballantyne, Andrew D.; Harris, Robert C.; Weston, David; Abbott, Andrew P.; Ryder, Karl S.

doi:10.1016/j.electacta.2019.02.090

Cited by 90 publications

(40 citation statements)

References 48 publications

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“…Table 1 which was less than that of which obtained from ethaline only. The lowering in current efficiency is often certain attributed to proton reduction [19].The rate of nickel deposition in the presence of ethylene diamine was found 10 ng/s as seen in Table 1. Figure 7(b) represents mass/charge plot for electrodeposition of nickel from reline with added ethylene diamine (en) is fairly noisy due to the low resonant amplitude of the quartz crystal in the DES media.…”

Section: Resultsmentioning

confidence: 93%

Gravimetric Studies of Ni Electrodeposition with Additives from Deep Eutectic Solvents Using Electrochemical Quartz Crystal Microbalance EQCM

Elttaib¹,

Benhmid²

2020

OJPC

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The gravimetric analysis of electrodeposited nickel is demonstrated using electrochemical quartz crystal microbalance (EQCM) where the nickel coatings come from a solution of the metal chloride salt separately in either a1choline chloride: 2 ethylene glycol (ethaline) or 1 choline chloride: 2 urea (reline) based ionic liquid. The possibility of adapting the Quartz Crystal Microbalance EQCM (which measures the mass attached to the electrode) to probe kinetics of electrochemically-driven solid state phase transformations has been explored in a Ni electrodeposition in absence and presence of complexing agents ethylene diamine en and acetylacetonate acac from both electrolytes ethaline and reline. The study shows that the current efficiency and the rate of deposition of nickel coatings obtained from ethaline and reline baths in absence of brighteners en and acac are different, and the addition of en and acac to both ionic liquid solutions results in a significant decrease current. And the associated growth rate will also be decreased, suggesting that the en acac stops the formation and growth of Ni nuclei. This suggests that the mechanism of growth is changed.

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Section: Resultsmentioning

confidence: 93%

Gravimetric Studies of Ni Electrodeposition with Additives from Deep Eutectic Solvents Using Electrochemical Quartz Crystal Microbalance EQCM

Elttaib¹,

Benhmid²

2020

OJPC

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“…[28] There were slight decreases in the reduction current peaks for Ag when sodium bromide was added to the plating bath at concentrations of 10, 20, and 50 mM; the largest concentration of sodium bromide (100 mM) was found to block the surface of the electrode, which meant that less metal was deposited and thus that the stripping peak was smaller. [17,19,28,59,70] As explained earlier, additives can be adsorbed onto the electrode surface and thus metal deposition cannot take place at the sites occupied by organic molecules. Molecules or additive ions will be adsorbed at the active sites or on the high points of the electrode surface, where the thickness of the diffusion layer is less than in the recesses; thus, molecules/ions will be transported faster.…”

Section: Effect Of Sodium Bromide On the Voltammetric Behaviour Of Mementioning

confidence: 99%

“…In the second, the additives can act as complexing agents, which can react with the metal ions in solution and make them more difficult to reduce. [17,[57][58][59] There have been relatively few studies into the effects of additives on metal electrodeposition in DESs, despite the potential importance of these processes and the ubiquitous use of brighteners and levellers in aqueous solutions. Electrodeposition of metals from ionic liquids has previously been studied, but the deposits so produced were dull and showed poor adhesion.…”

Section: Introductionmentioning

confidence: 99%

“…Our previous work (on the effects of boric acid, nicotinic acid and p-benzoquinone on the electrodeposition of Zn) was achieved from Ethaline 200. [59] The novelty of this work lies in the use of sodium bromide as an additive for the electrodeposition of Sn, Cu, Ag and Ni from Ethaline 200 (a 1:2 ChCl:EG-based liquid). NaBr was chosen as the additive as it is in common use as a brightener in the electroplating of metals from aqueous solutions.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

Alesary¹

2019

International Journal of Electrochemical Science

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A number of studies into the influence of additives on the electrodeposition of metals from aqueous solution have been reported in the literature. However, very few have studied the influence of additives on metal electrodeposition in Deep Eutectic Solvents (DESs). This work will show, for the first time, the effect of sodium bromide on the electrodeposition of tin, copper, silver and nickel from a deep eutectic solvent (DES)-based ionic liquid consisting of a stoichiometric 1:2 mix of choline chloride and ethylene glycol (Ethaline 200). It is shown that in the presence of sodium bromide, bright and smooth Cu and Ni deposits were formed. Cyclic voltammetry and chronocoulometry have been used to examine the electrochemical properties of the plating liquids in both the absence and presence of sodium bromide. It was found that the redox peak currents of the Sn and Ag electrolytes get smaller when sodium bromide is added to the electrolyte solution. The resultant surface morphologies, topography and roughness of Sn, Cu, Ag and Ni were investigated by scanning electron microscopy (SEM/ EDXS) and 3D optical microscopy (3D). The current efficiency of metal deposits was found to increase when the deposition was achieved from an electrolyte that contained sodium bromide.

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“…32,33 The importance of the additives comes from interesting effects on the growth and structure of the deposits. 34 The additives can be organic or metallic and ionic or nonionic. The additives act through adsorption on the plated surface and oen are incorporated into the deposit.…”

Section: Introductionmentioning

confidence: 99%

A novel viewpoint of an imidazole derivative ionic liquid as an additive for cobalt and nickel electrodeposition

et al. 2020

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Influence of additives on the electrodeposition of zinc from a deep eutectic solvent

Cited by 90 publications

References 48 publications

Gravimetric Studies of Ni Electrodeposition with Additives from Deep Eutectic Solvents Using Electrochemical Quartz Crystal Microbalance EQCM

Gravimetric Studies of Ni Electrodeposition with Additives from Deep Eutectic Solvents Using Electrochemical Quartz Crystal Microbalance EQCM

Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

A novel viewpoint of an imidazole derivative ionic liquid as an additive for cobalt and nickel electrodeposition

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