Influence behavior and mechanism of crystal orientation of Cu6Sn5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint

Zhang, Zhihang; Qu, Jiawei; Ma, Tao; Zhao, Yue; Zhou, Zhongshan; Huang, Jihua; Chen, Shuhai; Ye, Zheng; Yang, Jian

doi:10.1016/j.matchar.2024.113832

Materials Characterization

2024

DOI: 10.1016/j.matchar.2024.113832

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Influence behavior and mechanism of crystal orientation of Cu6Sn5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint

Zhihang Zhang,

Jiawei Qu,

Tao Ma

et al.

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Investigation on interfacial compound growth kinetics in Sn-0.7Cu/Cu solder joint and mechanism analysis: Experiments and molecular dynamics simulations

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Influence behavior and mechanism of crystal orientation of Cu6Sn5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint

Cited by 2 publications

References 43 publications

Investigation on interfacial compound growth kinetics in Sn-0.7Cu/Cu solder joint and mechanism analysis: Experiments and molecular dynamics simulations

Investigation on interfacial compound growth kinetics in Sn-0.7Cu/Cu solder joint and mechanism analysis: Experiments and molecular dynamics simulations

Influence behavior and mechanism of double-layer Gr stacking configuration on mechanical strength and thermoelectric transport properties of Cu/Gr composites

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