2014
DOI: 10.1002/adma.201403559
|View full text |Cite
|
Sign up to set email alerts
|

Individually Position‐Addressable Metal‐Nanofiber Electrodes for Large‐Area Electronics

Abstract: A individually position-addressable large-scale-aligned Cu nanofiber (NF) array is fabricated using electro-hydrodynamic nanowire printing. The printed single-stranded Cu NF has a diameter of about 710 nm and resistivity of 14.1 μΩ cm and is effectively used as source/drain nanoelectrode in pentacene transistors, which show a 25-fold increased hole mobility than that of a device with Cu thin-film electrodes.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

0
49
0

Year Published

2015
2015
2024
2024

Publication Types

Select...
9

Relationship

1
8

Authors

Journals

citations
Cited by 53 publications
(49 citation statements)
references
References 54 publications
0
49
0
Order By: Relevance
“…To achieve this functionality, we suggest a patternable and foldable substrate using our CNF hybrid film. Although many previous studies have reported on stretchable interconnects using graphene, 35 metal nanowires, 36 metal nanofiber, 37,38 and geometrical approaches, 39 conventional electronic devices fabricated on the elastomeric substrate are easily broken because most of the semiconductor, dielectric and encapsulation materials are still brittle. Therefore, the approach using origami substrates made of strain-free rigid plates with reversibly foldable and stretchable, elastomeric joints 40 has been considered as a promising strategy for stretchable electronics.…”
Section: Demonstration Of a Transparent Oled On The Hybrid Filmmentioning
confidence: 99%
“…To achieve this functionality, we suggest a patternable and foldable substrate using our CNF hybrid film. Although many previous studies have reported on stretchable interconnects using graphene, 35 metal nanowires, 36 metal nanofiber, 37,38 and geometrical approaches, 39 conventional electronic devices fabricated on the elastomeric substrate are easily broken because most of the semiconductor, dielectric and encapsulation materials are still brittle. Therefore, the approach using origami substrates made of strain-free rigid plates with reversibly foldable and stretchable, elastomeric joints 40 has been considered as a promising strategy for stretchable electronics.…”
Section: Demonstration Of a Transparent Oled On The Hybrid Filmmentioning
confidence: 99%
“…Pyrolysis of binding polymer and metal fiber‐like precursors along with concurrent nucleation and growth of metal nanoparticles is the common strategy to prepared orderly aligned metal nanowire arrays or grids. After devoting tremendous efforts to examining many kinds of viscous binding polymers and Cu precursors, Lee et al succeeded in transforming electrospun poly(vinylpyrollidone) (PVP) and Cu(II) trifluoroacetate (Cu(CO 2 CF 3 ) 2 , CTA) composite nanofibers into polycrystalline copper nanowire (CuNWs) based on EHD nanowire printing (ENP, another name of MES), shown in Figure a,b. The polymer and precursor components are decomposed in the air during the first step (500 °C, 1 h), leading to the formation of CuO nanowires as indicated by the energy dispersive X‐ray spectroscopy (EDXS) spectra in Figure c.…”
Section: Applications Via Ehd Direct‐writingmentioning
confidence: 99%
“…a) Schematic diagram of preparation of CuNWs array. Reproduced with permission . Copyright 2014, Wiley‐VCH.…”
Section: Applications Via Ehd Direct‐writingmentioning
confidence: 99%
“…[1][2][3][4][5] Among a variety of chemical approaches to deriving high-performance printable electrodes, the metallic nanoparticle-based strategy is recognized as the most achievable one, in terms of a facile synthetic pathway, low-temperature processability, high electrical conductivity, and chemical/environmental stability. 6 In particular, when electrical conductivity is a primary requisite, the metallic nanoparticles have a crucial advantage over organometallic precursors and conductive polymers.…”
Section: Introductionmentioning
confidence: 99%