Indentation size effect in polycrystalline F.C.C. metals

Elmustafa, A. A.; Stone, Donald S.

doi:10.1016/s1359-6454(02)00175-1

Cited by 159 publications

(65 citation statements)

References 19 publications

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“…This assumption was supported by the experimental results that experimental data of logarithmic SSCR versus sustained stress seemed to be approximately linear (Cao et al, 2012;Elmustafa and Stone, 2002;Raj and Langdon, 1989;Wang et al, 2009aWang et al, , 2009bWang et al, , 2011. On the other hand, a pure power-law relation of ε σ ∝ ss n was also assumed in the one-temperature approach.…”

mentioning

confidence: 76%

“…Then, one can obtain the activation volume from the experimentally determined relationship between nominal activation energy and sustained stress. In the literature, however, some researchers were trying to determine the activation volume from creep tests under various sustained stresses at only one temperature, usually room temperature (RT) (Cao et al, 2012;Elmustafa and Stone, 2002;Raj and Langdon, 1989;Wang et al, 2009aWang et al, , 2009bWang et al, , 2011. This approach is called one-temperature approach hereafter.…”

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confidence: 99%

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Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations

Yang

Wang

et al. 2016

Acta Materialia

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a b s t r a c tIn the present work, we performed experiments, atomistic simulations, and high-resolution electron microscopy (HREM) to study the creep behaviors of the nanotwinned (nt) and nanograined (ng) copper at temperatures of 22°C (RT), 40°C, 50°C, 60°C, and 70°C. The experimental data at various temperatures and different sustained stress levels provide sufficient information, which allows one to extract the deformation parameters reliably. The determined activation parameters and microscopic observations indicate transition of creep mechanisms with variation in stress level in the nt-Cu, i.e., from the Coble creep to the twin boundary (TB) migration and eventually to the perfect dislocation nucleation and activities. The experimental and simulation results imply that nanotwinning could be an effective approach to enhance the creep resistance of twin-free ng-Cu. The experimental creep results further verify the newly developed formula (Yang et al., 2016) that describes the time-, stress-, and temperature-dependent plastic deformation in polycrystalline copper.

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confidence: 76%

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confidence: 99%

Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations

Yang

Wang

et al. 2016

Acta Materialia

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“…However, the technique has also been fraught with potential artifacts, many of which are related to a phenomenon known as the "indentation size effect" [2][3][4][5][6][7][8][9][10][11]. This typically refers to the simple observation that the hardness measured by an indentation test is often not constant, but instead changes with applied load.…”

Section: Introductionmentioning

confidence: 99%

Mechanical behavior of Ti cold spray coatings determined by a multi-scale indentation method

Goldbaum

Ajaja

Chromik

et al. 2011

Materials Science and Engineering: A

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“…Hardness exhibits large scatter at very shallow depths, and then changes steadily with the indentation depth. For the very shallow indentations, the hardness variation can be explained by the indentation size effect or strain gradient plasticity theory [4]. Hardness change at deeper indentations can be explained by the substrate effect [5], although hardness, a measure of the materials ductile properties, should not change significantly with indentation depth.…”

Section: Introductionmentioning

confidence: 99%

“…In the Joslin-Oliver method, the contact area is eliminated. As a result, equations (2) and (3) can be rearranged as: (4).…”

Section: Introductionmentioning

confidence: 99%

Mechanical Properties of Evaporated Gold Films. Hard Substrate Effect Correction

Pang

Chen

et al. 2008

MRS Proc.

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Nanoindentation tests using the Berkovich indenter tip were performed on 50 and 200 nm thick polycrystalline gold films deposited on hard substrates. Gold film hardness increased with the indentation depth due to the influence of the substrate. A procedure based on the Joslin-Oliver method was introduced to correct for the substrate effect. The method utilizes the fact that the measured elastic modulus did not change significantly with the indentation depth for the two films tested, which allowed reducing the contact area variation used in the hardness calculation.

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Indentation size effect in polycrystalline F.C.C. metals

Cited by 159 publications

References 19 publications

Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations

Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations

Mechanical behavior of Ti cold spray coatings determined by a multi-scale indentation method

Mechanical Properties of Evaporated Gold Films. Hard Substrate Effect Correction

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