“…One understanding of material removal mechanism can be illustrated by indentation-sliding analysis [20,27]. The material removal happens in four stages.…”
Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.
“…One understanding of material removal mechanism can be illustrated by indentation-sliding analysis [20,27]. The material removal happens in four stages.…”
Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.
“…In brittle material subjected to high stresses, a zone of inelastic deformation immediately below the contact area may develop, leading to the formation of what are called 'vent cracks' [Lawn and Wilshaw, 1975]. Dissolution of minerals occurs preferentially at active sites such as edges, dislocations or microfractures [Lasaga, 1981;Schott et al, 1989].…”
Section: Deformation By a Combination Of Pressure Solution And Subcrimentioning
[1] For the first time, nanometer resolution techniques both in situ and ex situ were compared in order to study calcite dissolution under stress. The obtained results enabled identification of the relative importance of pressure solution driven by normal load and free surface dissolution driven by strain energy. It is found that pressure solution of calcite crystals at the grain scale occurred by two different mechanisms. Diffusion of the dissolved solid took place either at a rough calcite/indenter interface, or through cracks that propagated from the contact toward the less stressed part of the crystal. It is also found that strain rates are mostly a function of the active process, i.e., pressure solution associated or not with cracks, rather than being influenced by stress variations. Strain rates obtained in this study are in agreement with published data of experimental calcite and carbonate dissolution under stress.
“…Indentation fracture, often with a Vickers geometry and testing system [27], conventionally uses post-indentation characterization to assess if cracks are present in the sample, and then relates cracking behavior to the stress fields which drove crack propagation. Experiments have demonstrated that in some cases cracking can occur during loading of the indenter, while in other cases the cracks initiate upon unloading, as shown by Cook and Pharr [21].…”
Assessing the mechanical behavior (elastic properties, plastic properties, and fracture phenomena) of molecular crystals is often complicated by the difficulty in preparing samples. Pharmaceuticals and energetic materials in particular are often used in composite structures or tablets, where the individual grains can strongly impact the solid behavior. Nanoindentation is a convenient method to experimentally assess these properties, and it is used here to demonstrate the similarity in the mechanical properties of two distinct systems: individual crystals of the explosive cyclotetramethylene tetranitramine (HMX) and the pharmaceutical idoxuridine were tested in their as-precipitated state, and the effective average modulus and hardness (which can be orientation dependent) were determined. Both exhibit a hardness of 1.0 GPa, with an effective reduced modulus of 25 and 23 GPa for the HMX and idoxuridine, respectively. They also exhibit similar yield point behavior. This indicates idoxuridine may be a suitable mechanical surrogate (or "mock") for HMX. While the methodology to assess elastic and plastic properties was relatively insensitive to specific crystal orientation (i.e., a uniform distribution in properties was observed for all random crystals tested), the indentation-induced fracture properties appear to be much more sensitive to tip-crystal orientation, and an unloading slope analysis is used to demonstrate the need for further refinement in relating toughness to orientation in these materials with relatively complex slip systems and crystal structures.
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