Increase in Size of Flaked Particles Suddenly Generated by Impulsive Force in Mass-production Plasma Etching Equipment

Abstract

We investigate ‰aked particles instantaneously generated in mass-production plasma etching equipment. Particles ‰aking oŠ fromˆlms deposited on the ground electrode are detected by using laser light scattering system. Not only the number of particles but also the size of them obviously increases when micro-arc discharge occurs around a wafer and ‰oating potential (inner wall potential) changes instantaneously. The results of this study provide evidence that electricˆeld stress acts as impulsive force due to rapidly changing ‰oating potential, causing dramatically breaking of depositedˆlm and many large particles.

Investigation of the relationship between plasma etching characteristics and microstructures of alumina ceramics for chamber parts

“…Particles generated in plasma etching process are one of the most serious problems because they are a main cause of the decrease in the production yield and OEE. [11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27] The chamber parts which are short of useful life also increase the maintenance costs. Therefore, the chamber parts with higher resistance to reactive plasma etching are highly required to reduce corrosion and extend the lifetime of them.…”

Easy-to-use detection method for micro-arc discharge in plasma etching equipment by measuring current flowing to ground

“…[1][2][3][4] Arcing occurs suddenly during plasma process, damages wafers and parts of equipment, such as wafer stages, electrodes, and sputtering targets, and causes particle generation. [1][2][3][4][5][6] The process and equipment must be stopped for an extended period of time in order to locate the origin of arcing and repair any damaged parts. The production yield of LSI and the overall equipment effectiveness (OEE) are reduced by micro-arc discharge, which causes an increase in production cost.…”