Incorporation of vinyl silane and epoxy silane oligomer into 2-EHA-based polyacrylate latexes via mini-emulsion polymerization and investigation of pressure-sensitive adhesive properties on polar and nonpolar surfaces

Bilgin, Ecem Temelkaya; Dülgar, Cansu Akarsu; Serhatlı, İ. Ersin

doi:10.1007/s00289-019-02685-3

Cited by 2 publications

(2 citation statements)

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“…Bilgin et al [ 81 ] reported the synthesis and characterization of 2-ethylhexyl acrylate (2-EHA)-based latexes via mini-emulsion polymerization for pressure-sensitive adhesive (PSA) applications. The authors investigated the effects of two types of silanes, vinyltrimethoxysilane (VTMOS) and 3-glycidyloxypropyltrimethoxysilane (GPTMOS, Figure 5 (D)), on the adhesive performance of the latexes on polar and nonpolar surfaces.…”

Section: Hot-melt Adhesive Compositionmentioning

confidence: 99%

“…GPTMOS, as a non-polymerizable silane oligomer, increased the peel adhesion and loop tack values on both types of surfaces due to its epoxy functionality and polar interactions with substrates, but decreased the shear strength of the latexes. The work contributes to the understanding of the role of silanes in enhancing the adhesion and cohesion mechanisms of PSAs and offers an approach for tailoring the properties of PSAs according to specific requirements [ 81 ].…”

Section: Hot-melt Adhesive Compositionmentioning

confidence: 99%

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Organosilicon Compounds in Hot-Melt Adhesive Technologies

Czakaj,

Sztorch,

Romanczuk-Ruszuk

et al. 2023

Polymers

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Hot-melt adhesives (HMAs) are thermoplastic materials that can bond various substrates by solidifying rapidly upon cooling from the molten state, and their modification with organosilicon compounds can result in crosslinking behavior, characteristic of gels. Organosilicon compounds are hybrid molecules that have both inorganic and organic components and can enhance the properties and performance of HMAs. The gel aspect of HMA with and without organosilicon modifiers can be considered in organosilicon-modified systems, the modifiers are often either sol–gel condensation products or their mechanism of action on the adherent surface can be considered of sol–gel type. The purpose of this manuscript is to present the current state of the art on the formulation, characterization, and application of HMAs and optimize their performance with organosilicon compounds for application in various industries such as automotive, construction, and photovoltaics. This review covers articles published within the period of 2018–2022. The article is divided into sections, in which information about hot-melt adhesives is described at the beginning. The following part of the presented review focuses on the composition of hot-melt adhesives, which takes into account the use of organosilicon compounds. The last part of this review outlines the future trends in hot-melt adhesives.

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Section: Hot-melt Adhesive Compositionmentioning

confidence: 99%

Section: Hot-melt Adhesive Compositionmentioning

confidence: 99%