Incorporation of COF‐LZU‐1 into the terpolyimide matrix to obtain COF‐LZU‐1/terpolyimide composites with ultra‐low dielectric constant

Abstract

Polyimides are used in microelectronics as they possess the essential high tensile properties, high thermal stability and low dielectric constant. As the further reduction in their dielectric constant is indispensable for such applications, in this study it was loaded with the porous covalent organic framework (COF‐LZU‐1) to obtain COF‐LZU‐1/terpolyimide composites. The composites can capture much air (κ = 1) in their matrix and bring down the dielectric constant below the virgin polyimides. In the beginning, the terpoly(amic acid)s were prepared, then loaded with the COF‐LZU‐1, and subsequently, stage cured up to 350°C to obtain COF‐LZU‐1/terpolyimide composites. Their thermal degradation occurred close to 530°C, illustrating high thermal stability. Their dielectric constant decreased with an increase in the COF‐LZU‐1 loading from 1 to 4%. The lowest dielectric constant of 1.36 was obtained with 4% loading. So, COF‐LZU‐1 and different polyimides can be suitably combined to obtain composites with desirable characteristics for applications in microelectronics. POLYM. ENG. SCI., 59:814–820, 2019. © 2018 Society of Plastics Engineers

Constructing novel hyper-crosslinked In2S3@HLZU-1 through molecular expansion for enhanced photocatalytic performance

“…Similar to the simulated LZU-1, the synthesized LZU-1 had a peak at about 4.7°, which indicated that the material had a certain degree of crystallinity. 46 For the composite material IL- x ( x = 1–3), all diffraction patterns showed the four characteristic peaks of In 2 S 3 , and the characteristic peak of HLZU-1 at about 20° was slightly enhanced. On the one hand, this is because In 2 S 3 has a characteristic peak at 20.3°.…”

Enhanced Catalytic Activity for Levulinic Acid Esterification Using Covalent Organic Framework Heterogenized Heteropolyacids

“…The catalysts keep thermally stable below 400 °C and start to sharply decompose at 400 °C. 21,37 The weight loss assigned to pure HPW below 300 °C is due to the removal of physically adsorbed water and crystal water (Figure S1B), and the gradual weight loss from 500 to 900 °C originates from the decomposition of the Keggin anion. 38 Based on the TGA curves of the catalysts, the HPW/LZU1 mass ratio values were calculated for cross checking (Table 1), and they were found to be very close to the values determined by elemental analysis.…”