2023
DOI: 10.1039/d2nr05587b
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Incorporating paraffin@SiO2 nanocapsules with abundant surface hydroxyl groups into polydimethylsiloxane to develop composites with enhanced interfacial heat conductance for chip heat dissipation

Abstract: Incorporating phase change capsules into polymeric matrices is an effective approach to developing flexible composites with both heat storage capacity and good thermal reliability, while the interfacial heat conductance between...

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Cited by 4 publications
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References 37 publications
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