2002
DOI: 10.1007/bf02411059
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In-situ tensile testing of nano-scale specimens in SEM and TEM

Abstract: ABSTRACT--We present a new experimental method for the mechanical characterization of freestanding thin films with thickness on the order of nanometers to micrometers. The method allows, for the first time, in-situ SEM and TEM observation of materials response under uniaxial tension, with measurements of both stresses and strains under a wide variety of environmental conditions such as temperature and humidity.The materials that can be tested include metals, dielectrics, and multi-layer composites that can be … Show more

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Cited by 236 publications
(93 citation statements)
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“…[23][24][25][26][27][28][29] The micro-electromechanical system (MEMS) is another important approach for the in situ microscopy mechanics by TEM. 8,30 These devices are based on Si technology, and film deposition, lithography and etching techniques are used to design actuators and force sensors on a chip. One of the first successful MEMS devices for in situ TEM deformation studies of metallic lines was developed by Saif's group.…”
Section: Experimental Techniques By In Situ Microscopymentioning
confidence: 99%
“…[23][24][25][26][27][28][29] The micro-electromechanical system (MEMS) is another important approach for the in situ microscopy mechanics by TEM. 8,30 These devices are based on Si technology, and film deposition, lithography and etching techniques are used to design actuators and force sensors on a chip. One of the first successful MEMS devices for in situ TEM deformation studies of metallic lines was developed by Saif's group.…”
Section: Experimental Techniques By In Situ Microscopymentioning
confidence: 99%
“…They are generally measured by tensile testing of either free-standing thin films without substrates [6][7][8][9] or supported thin films on compliant substrates [10][11][12] . The freestanding tensile test is able to measure the mechanical properties of thin films directly without cumbersome calculation from substrate effects.…”
mentioning
confidence: 99%
“…The freestanding tensile test is able to measure the mechanical properties of thin films directly without cumbersome calculation from substrate effects. Nevertheless, the free-standing tensile test has disadvantages, in particular with fabricating and handling of freestanding thin-film specimens without damage, resulting from difficulties in separating the specimen from the substrate, and subsequent manipulation without forming wrinkles and cracks 8 . In contrast, the supported thin-film tensile test is also widely used as an alternative method, owing to advantages of convenient specimen fabrication and handling, by utilizing an underlying compliant substrate.…”
mentioning
confidence: 99%
“…Although tensile testing is popular for evaluation of mechanical properties, it is difficult to apply it to nano-component because it requires precise alignment and reliable gripping (Haque & Saif, 2002;Huang & Spaepen, 2000;Tsuchiya et al, 1998). Especially, bending (Motz et al, 2005;Namazu et al, 2000) and compression (Dimiduk et al, 2005 ;Moser & Wasmer, 2007) methods are often adopted.…”
Section: Specimen Gripping and Alignmentmentioning
confidence: 99%