“…Carrier devices prepared via MEMS technology allow for in situ S/TEM heating (or electrical) characterization of materials (Allard et al, 2009;Young et al, 2010). Conversely, EXLO of site specific and electron transparent FIB prepared specimens lends itself nicely for the precise placement of specimens onto these delicate MEMS devices (Bassim et al, 2014;Harlow et al, 2014) and examples will be described below. Lift out for positioning on MEMS devices performed inside the FIB (e.g., in situ lift out (INLO)) requires multiple manipulation and FIB milling steps to ensure that a suitable region of interest is electron transparent without FIB imaging or milling the MEMS support device (Duchamp et al, 2014).…”