“…In the Ag-Cu-Ti/SiC brazing system, the emergence of TiC layers precedes the Ti 5 Si 3 layer at the tip by investigating the nanoscale dynamic wetting and spreading of molten Ti alloy on 6H-SiC by Shun-Ichiro Tanaka et al and the detailed reaction mechanism analysis was in Section 3.3 and Figure7A and B 29. According to the research of Song et al and the EDS profile in Figure3B, the Layer 1 can consist of TiC, Ti 3 SiC 2 and Ti 5 Si 3 , which can be seen and proved from Figure4Aof the XRD diffraction pattern of metallization layer 21,28,30,31. F I G U R E 2 (A) Schematic diagram of sample assembly, (B) brazing process, and (C) schematic diagram of shear test F I G U R E 3 (A) SEM image of metallization layer and (B) EDS element line profile, and element distribution images of (C) Si, (D) C, and (E) Ti F I G U R E 4 XRD pattern from (A) metallized SiC; (B) brazing seam F I G U R E 5 Typical microstructure of SiC/2219 joint metallized at 1000 • C for 30 min…”