2019
DOI: 10.1111/jace.16541
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In‐situ synthesis of TiC nanoparticles during joining of SiC ceramic and GH99 superalloy

Abstract: The graphical abstract describes the SiC/GH99 joint brazed using AgCuTi filler metal incorporated with graphene nanoplatelets, in‐situ TiC nanoparticles characterization and in‐situ reaction mechanism.

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Cited by 15 publications
(10 citation statements)
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References 59 publications
(118 reference statements)
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“…This result was consistent with that of Song et al. obtained (the coated ‐SiC ceramics metallized with Ag26.7Cu4.5Ti foil at 980°C) 31 …”
Section: Resultssupporting
confidence: 93%
See 2 more Smart Citations
“…This result was consistent with that of Song et al. obtained (the coated ‐SiC ceramics metallized with Ag26.7Cu4.5Ti foil at 980°C) 31 …”
Section: Resultssupporting
confidence: 93%
“…In the Ag-Cu-Ti/SiC brazing system, the emergence of TiC layers precedes the Ti 5 Si 3 layer at the tip by investigating the nanoscale dynamic wetting and spreading of molten Ti alloy on 6H-SiC by Shun-Ichiro Tanaka et al and the detailed reaction mechanism analysis was in Section 3.3 and Figure7A and B 29. According to the research of Song et al and the EDS profile in Figure3B, the Layer 1 can consist of TiC, Ti 3 SiC 2 and Ti 5 Si 3 , which can be seen and proved from Figure4Aof the XRD diffraction pattern of metallization layer 21,28,30,31. F I G U R E 2 (A) Schematic diagram of sample assembly, (B) brazing process, and (C) schematic diagram of shear test F I G U R E 3 (A) SEM image of metallization layer and (B) EDS element line profile, and element distribution images of (C) Si, (D) C, and (E) Ti F I G U R E 4 XRD pattern from (A) metallized SiC; (B) brazing seam F I G U R E 5 Typical microstructure of SiC/2219 joint metallized at 1000 • C for 30 min…”
mentioning
confidence: 89%
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“…7° could be assigned as the (111) peak of Cu0.81Ni0.19 (JCPDS # 47-1406)[23], which indicates the predominance of copper-nickel phase. Here, Cu0.81Ni0.19 (around 3.59 Å) is the solid solution of copper in nickel, as nickel and copper are fully soluble.…”
mentioning
confidence: 99%
“…In addition, high joining temperatures inevitably lead to a large residual thermal stress in the ceramic-metal joints because of the high coefficient of thermal expansion (CTE) mismatch, which deteriorates the joint strength. 12 TLP bonding involves the formation of a liquid phase through the melting of interlayers or interfacial reactions and the isothermal solidification of the liquid by atomic interdiffusion; the joining temperature is lower compared with that in diffusion bonding, but the resultant joints show great potential for high-temperature applications. 13 However, the joining time for TLP bonding is typically several to tens of hours, which severely limits the use of this technique.…”
Section: Introductionmentioning
confidence: 99%