In Situ Synthesis and Properties of Epoxy Nanocomposites

Богданова, Л. М.; Kuzub, L. I.; Dzhavadjan, Emma; Rabenok, E. V.; Новиков, Г. Ф.; Pomogaĭlo, A. D.

doi:10.1002/masy.201100099

Cited by 17 publications

(3 citation statements)

References 17 publications

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“…The epoxy resin ED-20 with triethylamine in the presence of silver myristate was cured [127][128][129]. The reduction of the latter and the formation of silver nanoparticles occurred simultaneously during polymerization.…”

Section: Metal-containing Nanoparticles Synthesized In Situmentioning

confidence: 99%

Kinetic Features of Synthesis of Epoxy Nanocomposites

Иржак¹

2020

Nanorods and Nanocomposites

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Kinetic features of the formation of epoxy nanocomposites with carbon (nanotubes, graphene, and graphite), metal-containing, and aluminosilicate (montmorillonite and halloysite) fillers are considered. In contrast to linear polymers, epoxy nanocomposites are obtained only via the curing of epoxy oligomers in the presence of filler or the corresponding precursor. These additives may affect the kinetics of the process and the properties of the resulting matrix. A high reactivity of epoxy groups and a thermodynamic miscibility of epoxy oligomers with many substances make it possible to use diverse curing agents and to accomplish curing reactions under various technological conditions. The mutual effect of both a matrix and nanoparticles on the kinetics of the composite formation is discussed.

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Section: Metal-containing Nanoparticles Synthesized In Situmentioning

confidence: 99%

Kinetic Features of Synthesis of Epoxy Nanocomposites

Иржак¹

2020

Nanorods and Nanocomposites

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Section: Metal-containing Nanoparticles Synthesized In Situmentioning

confidence: 99%

Nanorods and Nanocomposites

Ghamsari¹,

Dhara²

2020

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His research focuses on photonic materials including metamaterials, quantum dots and plasmonic nanomaterials that can be used in a wide range of applications. His recent interests lie also in nano-bioimaging, 3D printing, nanostructures for tissue engineering (eg, ZnO, TiO 2), and biomaterials including carbon, graphene, and diamond quantum dots. He is a member of the editorial board and is a reviewer for different international journals. He collaborated with local and international academics/researchers on the graduation of post-graduate students and research projects. He edited 3 books and published 3 chapter books and over 95 articles in scientific journals as well as in reviewed conference proceedings.

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“…With the miniaturization of electronic equipment, electronic packaging has become increasingly complex and precise [ 1 , 2 , 3 , 4 ]. The use of electrically conductive adhesives (ECAs), which are thermoset polymers filled with metal fillers, is rapidly expanding due to their low cost and processing temperature [ 3 , 5 ]. ECAs are extensively used in the assembly and packaging of electronic devices such as high-density multilayer interconnect substrates and high-speed, high-frequency circuits [ 1 , 6 , 7 , 8 , 9 , 10 ].…”

Section: Introductionmentioning

confidence: 99%

Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor

et al. 2023

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With the miniaturization of electronic devices, electronic packaging has become increasingly precise and complex, which presents a significant challenge in terms of heat dissipation. Electrically conductive adhesives (ECAs), particularly silver epoxy adhesives, have emerged as a new type of electronic packaging material, thanks to their high conductivity and stable contact resistance. However, while there has been extensive research on silver epoxy adhesives, little attention has been paid to improving their thermal conductivity, which is a critical requirement in the ECA industry. In this paper, we propose a straightforward method for treating silver epoxy adhesive with water vapor, resulting in a remarkable improvement in thermal conductivity to 9.1 W/(m·K), three times higher than the sample cured using traditional methods (2.7 W/(m·K)). Through research and analysis, the study demonstrates that the introduction of H2O into the gaps and holes of the silver epoxy adhesive increases the path of electron conduction, thereby improving thermal conductivity. Furthermore, this method has the potential to significantly improve the performance of packaging materials and meet the needs of high-performance ECAs.

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In Situ Synthesis and Properties of Epoxy Nanocomposites

Cited by 17 publications

References 17 publications

Kinetic Features of Synthesis of Epoxy Nanocomposites

Kinetic Features of Synthesis of Epoxy Nanocomposites

Nanorods and Nanocomposites

Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor

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