“…In particular, the thermal properties of the AlN layer are desirable for the growth of high-quality GaN layer, i.e., the small difference in the TECs between the AlN layer and substrate are expected to reduce wafer bowing, dislocation density, and residual strain (the TECs of SCAM, sapphire, AlN, and GaN are ~6.2 × 10 −6 , ~8.3 × 10 −6 , 4.2 × 10 −6 , and 5.6 × 10 −6 /°C, respectively) [ 23 , 28 ]. Considering these advantages, improved crystallinity and reduced residual stress in an undoped-GaN (u-GaN) template layer grown on a c -sapphire substrate have been demonstrated by replacing a conventional in situ LT-GaN buffer layer with an ex-situ sp-AlN buffer layer [ 29 ]. Taking such improvements, an improved internal quantum efficiency (IQE) of green and ultraviolet-emitting QWs grown thereon has been demonstrated [ 27 , 29 , 30 , 31 ].…”