In situ study on reverse polarity effect in Cu/Sn–9Zn/Ni interconnect undergoing liquid–solid electromigration

Huang, Mingliang; Zhang, Z.J.; Zhao, Ning; Yang, Fan

doi:10.1016/j.jallcom.2014.08.263

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In situ study on reverse polarity effect in Cu/Sn–9Zn/Ni interconnect undergoing liquid–solid electromigration

Cited by 21 publications

References 23 publications

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X‐ray Imaging for Nondestructive Analysis of Material Microstructures

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