Abstract:With the advent of lead-free soldering electronic packaging industry, there are growing concerns regarding the problems of voids in lead-free solder joints. Many researchers are eager to understand the growth,evolution and control factors of bubbles. Due to the restrictions in test conditions imposed by high temperature and opacity of soldering, one cannot directly observe and analyze the behaviour of bubbles. Moreover, bubble evolution and surface reaction effects go hand in hand with each other during solder… Show more
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