“…Indeed, considerable effort is being devoted to the development of materials with significant copper content [1][2][3][4][5][6][7] for applications in petrochemical and electronic industry [4,6,8] as well as in aerospace, where the ability to remove heat and retain sufficient strength is of critical importance [9,10]. Development of such composites with high conductivity and also high strength can be achieved by uniformly distributed ceramic materials such as oxides, borides, carbides and nitrides [2,4,5,[11][12][13] or silicides [14]. Especially TiB 2 , due to extremely high stiffness and hardness (3400HV) [3,10,15,16], ultra-high melting point (3225 o C) [3,17] and the best among borides and carbides both thermal and electrical conductivity (66W/mK) [3,18] is suitable candidate for Cu-matrix composite [7,11,12,[19][20][21].…”