In situ observation on the solidification of Sn-10Cu hyperperitectic alloy under direct current field by synchrotron microradiography

Xuan, Zhenjing; Mao, Feng; Cao, Zhiqiang; Wang, Tongmin; Zou, Longjiang

doi:10.1016/j.jallcom.2017.05.302

Cited by 18 publications

(7 citation statements)

References 35 publications

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“…It has been suggested in these studies, that there exists a critical cooling rate, which when exceeded, allows the direct nucleation of independent phases. Xuan et al [29] also presented similar findings for the Sn-10Cu alloy, devoid of Cu 3 Sn, when a DC field was applied. This result was attributed, to the electrochemical potential change experienced by the alloy system when exposed to a DC field.…”

Section: Cu 3 Sn Suppressionmentioning

confidence: 57%

“…The potential loss of solder joint reliability associated with Cu 3 Sn, suggests there would be benefits from understanding how to minimise or remove this phase from the microstructure of soldered joints. In addition to thermal control methods such as increased cooling rate, it has been recently reported by Xuan et al [29] that the application of a direct current (DC) field to Sn-10wt.%Cu alloys during solidification, resulted in the direct nucleation of Cu 6 Sn 5 from the liquid phase, and suppression of the primary Cu 3 Sn phase.…”

Section: Introductionmentioning

confidence: 99%

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Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni

Mehreen

Nogita

McDonald

et al. 2018

Journal of Alloys and Compounds

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The effect of Ni additions on the peritectic reaction and phase formation in the Sn-10wt.%Cu alloy is investigated through cooling curve analysis, in situ synchrotron observation during alloy solidification, and microstructural analysis of as-cast alloy by optical and electron microscopy. More specifically, this study examined the effect of Ni to determine whether Cu 3 Sn can be completely suppressed. The results showed that the addition of Ni in the range of 0.06wt.%-1 wt.% completely suppressed the formation of primary Cu 3 Sn phase, and instead Cu 6 Sn 5 directly nucleates from the melt. It is proposed that increasing the amount of Ni decreases the amount of Cu 3 Sn until it is completely suppressed by shifting the Cu 3 Sn phase boundaries, such that Cu 6 Sn 5 forms throughout the microstructure. The results from this study provide an opportunity to better understand the solidification behaviour of Sn-10Cu alloys with Ni additions.

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Section: Cu 3 Sn Suppressionmentioning

confidence: 57%

Section: Introductionmentioning

confidence: 99%

Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni

Mehreen

Nogita

McDonald

et al. 2018

Journal of Alloys and Compounds

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“…A series of dynamic phenomena during solidification have been observed directly using synchrotron X-ray radiography, such as columnar-to-equiaxed transition (CET) [8], dendrite growth [6], dendrite arm coarsening [9], etc. Moreover, the microstructure evolution of alloy solidification under external fields, such as electric field [10,11], magnetic field [12,13] and ultrasonic field [7,14,15], was also conducted using in situ synchrotron X-ray radiography. The related studies show the ability of synchrotron X-ray radiography for studying in-situ the evolution of microstructure during solidification, and thus it can be used to in-situ study the solidification process under different cooling rates.…”

Section: Introductionmentioning

confidence: 99%

In-situ studies and simulation of equiaxed solidification in Al–20Cu alloy

Luo

Yang

Chen

et al. 2021

Materials Science and Technology

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The equiaxed solidification of Al–20Cu alloy under different cooling rates was investigated using in-situ synchrotron X-ray radiography. The results showed that mean grain size increases rapidly at the early stage of solidification, then reaches the final grain size gradually. And the change of final mean grain size with cooling rate follows d = 4132.3 × R−0.86. In addition, the evolution of grain size in Al–20Cu alloy was also simulated by ProCAST software. The experimental and simulation results indicated that, in the range of the cooling rate (5.0–7.5 K min−1), the major factor influencing the final grain size is the maximum nucleation density, while the nucleation undercooling has an insignificant effect on the final grain size.

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“…Most recently, applying the electric field during metallic solidification became a promising way to control and modify the solidification process in order to optimize the microstructures [13][14][15]. Due to thermal phenomena which includes Joule, Peltier and Thomson effects, etc., heat may be emitted or absorbed during crystal solidification with an electric current passing through the sample [16][17][18][19]. It is has been proved that for different pure substances (Sn and Bi), the dendritic morphology shows different sidebranching characteristics with applied electric field.…”

Section: Introductionmentioning

confidence: 99%

Thermoelectric effects induced dendrite branching dynamics in pure substances: An insight from morphological theory

Cao

Gao

et al. 2020

Eur. Phys. J. E

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Insights on the mechanical behavior in materials highly depend upon sufficiently characterizing microstructure details at the relevant length scales. In this study, the side-branching dynamics of dendritic structures formation in pure substances is studied upon the phase-field simulations of crystallization with applied direct currents. The effect of heat diffusion (including thermoelectric effect and undercooling) on the dendritic development is investigated, and the characteristics of the primary arms and side-branches are identified by implementing the image recognition technique. Results indicate that increasing the latent heat release would firstly enhance the side-branching and then cause the side-branches re-melting with large heat extraction form the solid. The side-branching could be tailored by rationally controlling the applied electric filed as well the heat treatment, which could be a potential way to improve the mechanical properties in metallic materials via optimizing the microstructure.

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In situ observation on the solidification of Sn-10Cu hyperperitectic alloy under direct current field by synchrotron microradiography

Cited by 18 publications

References 35 publications

Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni

Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni

In-situ studies and simulation of equiaxed solidification in Al–20Cu alloy

Thermoelectric effects induced dendrite branching dynamics in pure substances: An insight from morphological theory

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