2016
DOI: 10.1007/s00339-016-0718-z
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In situ inclusion of Au nanoparticles in porous silicon structure

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Cited by 5 publications
(7 citation statements)
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“…PS is obtained by chemical etching using chloroauric acid (HAuCl 4 ) in the electrolyte, considering a simple and alternative method to conventional methods (cathodic spraying, chemical vapor deposition, electrodeposition, electrolysis) [17]. This technique is based on localized oxidation, reduction of reactions under open circuit and dissolution of silicon (Si) in hydrofluoric acid (HF) while metal (usually a noble metal) catalytically improves the process of engraving [18].…”
Section: Introductionmentioning
confidence: 99%
“…PS is obtained by chemical etching using chloroauric acid (HAuCl 4 ) in the electrolyte, considering a simple and alternative method to conventional methods (cathodic spraying, chemical vapor deposition, electrodeposition, electrolysis) [17]. This technique is based on localized oxidation, reduction of reactions under open circuit and dissolution of silicon (Si) in hydrofluoric acid (HF) while metal (usually a noble metal) catalytically improves the process of engraving [18].…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, porous Si has been widely used in many applications because of its excellent photoelectric properties and chemical properties, such as biological sensors [ 17 , 25 ], solar cell [ 26 ], biomedical devices [ 27 ], and catalysis [ 28 ]. The porosity of the material is controlled by varying the anodization current density, and the pore length is controlled by varying the time of etching for a certain etchant at constant temperature [ 29 ]. The pore diameter and surface morphology can also be tuned by varying the etching parameters and the Si wafer type.…”
Section: Introductionmentioning
confidence: 99%
“…This technique is similar to the commonly used electrochemical attack in the PS manufacturing; but, in this process, using metal salt in the electrolyte. Additionally, it allows the tuning of the properties in PS with physical parameters (thickness, pore diameter, and doping level) [14]. Thickness can be controlled through the etching time; pore diameter is controlled by the used electrolyte; and doping level is controlled by the amount of metal salt supplied [14].…”
Section: Global Journal Of Nanomedicinementioning
confidence: 99%
“…Additionally, it allows the tuning of the properties in PS with physical parameters (thickness, pore diameter, and doping level) [14]. Thickness can be controlled through the etching time; pore diameter is controlled by the used electrolyte; and doping level is controlled by the amount of metal salt supplied [14]. The size of the gold nanoparticles can be around 20 nm and the pore size around 1.5 µm.…”
Section: Global Journal Of Nanomedicinementioning
confidence: 99%
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