1993
DOI: 10.1016/0168-583x(93)96182-c
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In situ detection of rearrangement processes during electron beam annealing of ion implanted InP

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Cited by 30 publications
(7 citation statements)
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“…The implantations were performed at the 60 kV implanter of the Institut fü r Kernphysik. Subsequently, the samples were thermally treated in a 20 kV electron beam annealing equipment under high vacuum conditions (residual gas pressure 2 Â 10 --6 mbar) [21]. Since the emission coefficient of the implanted surface region is not known and additionally changes during the annealing process, the surface temperature of the sample was measured with a two colour pyrometer (type ISQ 10 LO, Impac, Germany).…”
Section: Methodsmentioning
confidence: 99%
“…The implantations were performed at the 60 kV implanter of the Institut fü r Kernphysik. Subsequently, the samples were thermally treated in a 20 kV electron beam annealing equipment under high vacuum conditions (residual gas pressure 2 Â 10 --6 mbar) [21]. Since the emission coefficient of the implanted surface region is not known and additionally changes during the annealing process, the surface temperature of the sample was measured with a two colour pyrometer (type ISQ 10 LO, Impac, Germany).…”
Section: Methodsmentioning
confidence: 99%
“…The sample temperature was held near room temperature (RT) during the implantation. The implanted samples were thermally treated in a 20 keV electron beam annealing equipment [11] under high vacuum conditions. The total pressure of the residual gas was 2 Â 10 -6 mbar and the partial pressure of its O 2 component was 3 Â 10 -7 mbar measured with a residual gas analyzer (Quadrex 200, Leybold Inficon).…”
Section: Methodsmentioning
confidence: 99%
“…10 This electron beam rapid thermal annealing process (EBA) offers the opportunity to examine the effect of annealing under high vacuum conditions ͑Ͻ1 ϫ 10 −6 mbar͒. Under such conditions of low oxygen partial pressure, and at typical annealing temperatures, reactions between silicon and oxygen form volatile SiO, in preference to SiO 2 growth, and thus the growth of a surface oxide layer is suppressed.…”
mentioning
confidence: 99%