In-Situ Analysis of Deformation and Mechanical Stress of Packaged Silicon Dies With an Array of Hall Plates

Husstedt, Hendrik; Ausserlechner, Udo

doi:10.1109/jsen.2011.2154326

Cited by 23 publications

(20 citation statements)

References 15 publications

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“…Note that even though the warpage (in Fig. 19 in [18]) is smaller at room temperature the difference θ y − θ x is constant up to 70 • C. To sum up: warpage is not a significant problem as long as the Hall circle has a diameter about 1 mm and the aspect ratio of chip and package is within 0.7 . .…”

Section: Appendix Cmentioning

confidence: 90%

“…In (22) the signals h 13 and h 24 are lengthy functions of rotation angle, assembly tolerances, and magnet according to (4) and (18). The expressions get shorter if we approximate them by a Taylor series like in [1,4,5], which is admissible for small assembly tolerances.…”

Section: Errors Of Axialc4 Sensors Due To Assembly Tolerancesmentioning

confidence: 99%

“…Yet, in [18] it was proven that the chip has a typical warpage of about 0.1 • depending on temperature, aging of organic materials, and moisture content of the mould compound of the sensor package. Axial sensors are larger than perpendicular ones due to the Hall circle with diameter 2R 0 .…”

Section: Appendix Cmentioning

confidence: 99%

“…For the warpage we take the measured values of Fig. 19 in [18]: at low temperature we get θ x = 0.076 • , θ y = 0.05 • for 2R = 1.1 mm. This leads to an angle error of 0.044 • .…”

Section: Appendix Cmentioning

confidence: 99%

“…SMD packages suffer from mechanical stress asymmetries coupled from printed circuit boards to the chip. For a guess of inhomogeneities of mechanical stress on the Hall plates we refer to [18]: there measurements in Fig. 20 show that σ xx +σ yy changes by 80 MPa between packages that were first dried out in an oven and afterwards stored at large ambient humidity for several days.…”

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confidence: 99%

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A Theory of Magnetic Angle Sensors With Hall Plates and Without Fluxguides

Ausserlechner¹

2013

PIER B

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Abstract-Magnetic angle sensors detect the angular position of a permanent magnet attached to a rotating shaft. The magnet is polarized diametrically to the rotation axis. No soft magnetic flux guides are present. The semiconductor die is placed on and orthogonal to the rotation axis. There are two kinds of systems: (i) perpendicular systems detect the field components perpendicular to the rotation axis, and (ii) axial systems detect the component parallel to the rotation axis. The former use magneto-resistive sensors or vertical Hall effect devices; the latter use Hall plates. This paper focuses on axial systems, derives their conceptual limitations, and compares them with perpendicular systems. An optimized system and optimum shapes of magnets are reported. Angle errors due to assembly tolerances of magnet and sensor versus shaft are explained. It is proven that assembly tolerances of optimized axial systems give three times larger errors than perpendicular systems.

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Section: Appendix Cmentioning

confidence: 90%

Section: Errors Of Axialc4 Sensors Due To Assembly Tolerancesmentioning

confidence: 99%

Section: Appendix Cmentioning

confidence: 99%

“…For the warpage we take the measured values of Fig. 19 in [18]: at low temperature we get θ x = 0.076 • , θ y = 0.05 • for 2R = 1.1 mm. This leads to an angle error of 0.044 • .…”

Section: Appendix Cmentioning

confidence: 99%

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confidence: 99%

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