In-line Critical Dimension Measurement System Development of LCD Pattern Proposed by Newly Developed Edge Detection Algorithm

Park, Sunghoon; Lee, Jeongho; Pahk, Heui Jae

doi:10.3807/josk.2013.17.5.392

Cited by 4 publications

(3 citation statements)

References 13 publications

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“…In 2013, Park et al [40] proposed a new edge Box III detection algorithm which used facet model to provide more stable and accurate TFT-LCD pattern and detect the edge most reliably and precisely, compared to other algorithms. With such an algorithm, the standard deviation of measurement can be quite small.…”

Section: Simulation Studymentioning

confidence: 99%

What can fuzziness do for capability analysis based on fuzzy data

Chen

Hung

2019

Scientia Iranica

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One advantage of process incapability index over the classical process capability index is that it provides uncontaminated separation between process accuracy and process precision. However, the value of the index is di cult to determine accurately when process parameters cannot be determined precisely. In such a case, fuzzy set theory can be applied to obtain more exible and sensitive information. In this paper, a fuzzy process incapability index is proposed when the speci cation limits are assumed to be type-2 fuzzy. When the process mean and variance are unknown and when the observations are measured imprecisely, three fuzzy estimators are considered. A simulation study is conducted based on the Thin-Film-Transistor Liquid-Crystal Display (TFT-LCD) fuzzy process. By applying the total integral value method to the membership function of a fuzzy index, it becomes easier to make a comparison of the quality of di erent processes.

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Section: Simulation Studymentioning

confidence: 99%

What can fuzziness do for capability analysis based on fuzzy data

Chen

Hung

2019

Scientia Iranica

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“…This tomographic image is reconstructed from the focused image data for each pixel of the images captured by the camera's CCD through a 3D objective lens during vertical scanning of the 3D measurement using white-light scanning interferometry. Edge points at the bottom of the hole are detected in the tomographic image by a subpixel edge-detection algorithm [14], and the diameter is calculated by least-squares circle fitting of these edge data points, as shown in Fig. 3, where the green line indicates the fitted circle.…”

Section: Tomographic Image Analysis Methodsmentioning

confidence: 99%

Methods to Measure the Critical Dimension of the Bottoms of Through-Silicon Vias Using White-Light Scanning Interferometry

Hyun

Kim

Pahk

2014

Journal of the Optical Society of Korea

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Through-silicon vias (TSVs) are fine, deep holes fabricated for connecting vertically stacked wafers during three-dimensional packaging of semiconductors. Measurement of the TSV geometry is very important because TSVs that are not manufactured as designed can cause many problems, and measuring the critical dimension (CD) of TSVs becomes more and more important, along with depth measurement. Applying white-light scanning interferometry to TSV measurement, especially the bottom CD measurement, is difficult due to the attenuation of light around the edge of the bottom of the hole when using a low numerical aperture. In this paper we propose and demonstrate four bottom CD measurement methods for TSVs: the cross section method, profile analysis method, tomographic image analysis method, and the two-dimensional Gaussian fitting method. To verify and demonstrate these methods, a practical TSV sample with a high aspect ratio of 11.2 is prepared and tested. The results from the proposed measurement methods using white-light scanning interferometry are compared to results from scanning electron microscope (SEM) measurements. The accuracy is highest for the cross section method, with an error of 3.5%, while a relative repeatability of 3.2% is achieved by the two-dimensional Gaussian fitting method.

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“…Interferometry is used for repeated measurements of PS and inspection. A 3D height image and 2D tomographic image can be obtained from interferometry measurements [8][9][10]. e height of the PS can be measured based on the 3D height image, and the axial CD measurement and the defect of the shape itself can be inspected using the 2D tomographic image.…”

Section: Introductionmentioning

confidence: 99%

Defect Inspection in Display Panel Using Concentrated Auto Encoder

2019

International Journal of Optics

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In this paper, concentrated auto encoder (CAE) is proposed for aligning photo spacer (PS) and for local inspection of PS. The CAE method has two characteristics. First, unaligned images can be moved to the same alignment position, which makes it possible to move the measured PS images to the same position in order to directly compare the images. Second, the characteristics of the abnormal PS are maintained even if the PS is aligned by the CAE method. The abnormal PS obtained through CAE has the same alignment as the reference PS and has its abnormal characteristics. The presence or absence of defects and the location of defects were identified without precisely measuring the height of the PS and critical dimension (CD). Also, alignment and defect inspection were performed simultaneously, which shortened the inspection time. Finally, inspection performance parameters and inspection time were analyzed to confirm the validity of the CAE method and were compared with the image similarity comparison methods used for defect inspection.

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In-line Critical Dimension Measurement System Development of LCD Pattern Proposed by Newly Developed Edge Detection Algorithm

Cited by 4 publications

References 13 publications

What can fuzziness do for capability analysis based on fuzzy data

What can fuzziness do for capability analysis based on fuzzy data

Methods to Measure the Critical Dimension of the Bottoms of Through-Silicon Vias Using White-Light Scanning Interferometry

Defect Inspection in Display Panel Using Concentrated Auto Encoder

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