In-house development of co-fireable thick film silver conductor for LTCC applications

Jagtap, Shweta; Deshpande, Varsha; Rane, Vivek; Rane, Sunit; Phatak, Girish; Amalnerkar, Dinesh

doi:10.1007/s10854-007-9373-7

Cited by 13 publications

(13 citation statements)

References 10 publications

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“…Silver softened and melted at 875°C leading to particle size increase. This is a signal of sintering process achievement [10]. Some pores were observed through the line after curing.…”

Section: Esem Imagesmentioning

confidence: 76%

“…In fact, low evaporation rate solvents conferring high viscosities to the paste are needed in order to avoid ink drying during printing and thus mesh blocking. Besides, in major research studies based on screen printing ink formulation, solvent systems are used to prepare conductive silver pastes [8,9,10]. In order to reduce solvents impact on environment and thus decrease VOC (Volatile Organic Component) emission, Datta et al [11] prepared low VOC UV-curable silver adhesive by mixing acrylate monomers and radical initiator to flake and sphere shape silver particles.…”

Section: Introductionmentioning

confidence: 99%

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Silver content effect on rheological and electrical properties of silver pastes

Faddoul

Reverdy-Bruas

Bourel

2011

J Mater Sci: Mater Electron

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The novelty of this work is laboratory formulation of environmentally friendly, water-based silver inks adapted for screen printing. The challenge was also to elaborate inks that can withstand temperatures as high as 900°C. Indeed, when printed on ceramic substrate, they were sintered at these high temperatures. These inks can replace conductive silver pastes present in the market, today, and containing irritant solvents such as terpineol and other aromatic solvents. Besides, screen printing is considered as an additive technique, thus allowing reducing wastes. Furthermore, only with 72.5% silver, considered as low content compared to commercial inks (C75%), prepared inks presented good electrical resistivity, 23 nX m, close to that of bulk silver resistivity, 16 nX m. Formulation of silver inks with spherical particles, 2-3 lm mean diameter, was performed. The aim of the study was to determine silver content effect on pastes rheological behaviour, lines properties (width, thickness and roughness) and electrical properties. Therefore, rheological behaviour of inks was studied; in particular, Casson and Bingham models were applied in order to determine the yield stress. Viscosity evolution as a function of shear rate was also determined. Besides, the thixotropic behaviour of inks was highlighted. Inks were then screen printed on alumina sintered substrates and cured at different temperatures during 15 min. Topography measurements were performed. Line resistivity as small as 35 nX m was measured on cured lines. These inks, printed on ceramic tapes, can be used to print microwave transmission lines, for which resistivities lower than 1 mX m are requested.

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“…Silver softened and melted at 875°C leading to particle size increase. This is a signal of sintering process achievement [10]. Some pores were observed through the line after curing.…”

Section: Esem Imagesmentioning

confidence: 76%

Section: Introductionmentioning

confidence: 99%

Silver content effect on rheological and electrical properties of silver pastes

Faddoul

Reverdy-Bruas

Bourel

2011

J Mater Sci: Mater Electron

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“…If the substrate sticks to the setter, the shrinkage rate varies locally so that contraction does not occur isotropically in the X and Y directions and thus the substrate bends (Hsueh and Evans, 1985;Jagtap et al , 2008). Warpage of the substrate is also due to a correlation between particle arrangement and distortion, which is governed by non-uniform shrinkage.…”

Section: Warpagementioning

confidence: 99%

“…The ability to co-fi re many layers simultaneously consisting of dielectric ceramics with an internal metallic electrode between the layers with matching physical and chemical compatibility has the advantages of reducing process costs and process variability (Kim and Koh, 2008). Furthermore, the combination of good electrical, thermal and mechanical properties such as high thermal conductivity, low dielectric loss, low dielectric constant and low thermal coeffi cient of expansion in semiconductor devices has made LTCC © Woodhead Publishing Limited, 2014 packaging a key approach for successful applications in the microelectronics industry (El-Kheshen and Zawrah, 2003;Shao et al , 2005;Dileep Kumar et al , 2008;Jagtap et al , 2008).…”

Section: Introductionmentioning

confidence: 99%

Multilayer glass–ceramic composites for microelectronics: processing and properties

Alias

2014

Advances in Ceramic Matrix Composites

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“…In this investigation a commercially available Ag loaded via paste and Ag loaded track paste supplied by Heraeus were examined. Both materials are a suspension of functional Ag particles in an organic vehicle, to which a binder is added such as glass frit [5]. The via paste selected for this investigation is commonly printed through a metal stencil and has a viscosity of 100-200 Pas where the track paste is designed for screen printing and is less viscous at 45-70 Pas.…”

Section: Ag Paste Selectionmentioning

confidence: 99%