Microelectromechanical Systems 2006
DOI: 10.1115/imece2006-15176
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In-Chip Device-Layer Thermal Isolation of MEMS Resonator for Lower Power Budget

Abstract: This paper presents a thermally isolated ovenized design of MEMS resonator. Ovenization (joule heating) is done to compensate for the temperature dependence of resonator frequency. An ovenized resonator has a stable frequency over a wide temperature range of -40°C to 85°C. However, the ovenized designs lead to power consumption because of joule heating. It is therefore necessary to thermally isolate the device in order to reduce the power consumption. In this paper, we demonstrate an in-chip thermal isolation … Show more

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Cited by 4 publications
(2 citation statements)
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“…The adopted concept is based on the micro-oven concept of heating the device to a temperature than its typical operating temperature. Such method has been demonstrated to be very successful as a temperature compensation method [6][7][8][9].…”
Section: T = 16768r -76604 (4)mentioning
confidence: 99%
“…The adopted concept is based on the micro-oven concept of heating the device to a temperature than its typical operating temperature. Such method has been demonstrated to be very successful as a temperature compensation method [6][7][8][9].…”
Section: T = 16768r -76604 (4)mentioning
confidence: 99%
“…Due to the shortcomings of the design in section 4.1.1, the next design implemented an isolated heat source from the channel substrate by fabricating suspended heater surrounded by air [65][66][67]. In this case, the whole pump was made out of silicon including the heater and the top cover.…”
Section: Silicon Micro-machined Pumpmentioning
confidence: 99%