In-air sintering of copper nanoparticle paste with pressure-assistance for die attachment in high power electronics

Abstract

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Mass and density determination of porous nanoparticle films using a quartz crystal microbalance

“…These same properties make nanoparticles excellent sensing materials for chemical sensors [4][5][6]. In microelectronics, the low melting point of metallic nanoparticles has been used to create interconnects or as lead free solder alternative [7][8][9]. There are currently many synthesis methods available to make nanoparticles, each with their own advantages and disadvantages [5,[10][11][12][13].…”

Thermal and mechanical analysis of low-temperature and low-pressure silver-based sintered thermal joints

“…Analysing many articles, it was shown (Felba, 2018) that the highest shear strength values were obtained when both joined surfaces were metallized with silver (average value of 42 MPa) and gold (30 MPa), or there were different metallizations of the surfaces to be joined; Ag + Au (26 MPa), Ag + Cu (52 MPa), Au + Cu (64 MPa). Joints with Ag + Ag metallization were the most often tested as those with sintered Ag on copper metallization, as well as using sintered copper nanoparticles required special joining procedures because copper is easily oxidized (Siow et al , 2019; Zhang et al , 2021; Chen and Siow, 2021). Many authors assumed that sintered Ag can be treated as a very good electrical and thermal conductor, and the exact methods of measuring the thermal conductivity of the joint itself (i.e.…”

High-Temperature Nanoindentation Characterization of Sintered Nano-Copper Particles Used in High Power Electronics Packaging

“…The high temperature mechanical performances of sintered nanocopper materials are essential to guarantee the package and module level reliability of power electronics, as they will suffer thermal fatigue and creep failures when exposed to high temperature cycling application conditions [5]. Thus, it is necessary to investigate the mechanical deformation behavior of sintered nano-copper materials at high temperatures and establish the reasonable constitutive models used in reliability and lifetime estimation [6,7]. Presently, a common method to characterize the mechanical properties of sintered nano-metal materials is through the stress-strain relationship obtained by uniaxial tensile or shear tests [8][9][10][11][12].…”