Impurity analysis of electroplated gold components with multi-layered structures by thermal desorption spectrometry toward application in gold Micro electro mechanical system capacitive accelerometers

Akiyama, Takumi; Kurioka, Tomoyuki; Chen, Chun-Yi; Chang, Tso-Fu Mark; Chakraborty, Parthojit; Machida, Katsuyuki; Ito, Hiroyuki; Miyake, Yoshihiro; Sone, Masato

doi:10.1016/j.mne.2023.100226

Cited by 1 publication

(2 citation statements)

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“…Furthermore, the recent report proves that the thermal treatment process is effective to decrease the impurities derived from Au electroplating, which induces the drift phenomena and leads to a decrease in reliability in long-term use. 26 This study clearly constructs the strategy to suppress the warpage deformation of the Au-electroplated proof masses in the Au-MEMS capacitive accelerometers caused by the thermal treatment process. The constructed strategy is expected to facilitate the development of a next-generation MEMS capacitive accelerometer with high sensitivity.…”

Section: Discussionmentioning

confidence: 93%

“…Comparing the two scanned directions (i.e., aa and bb), the deformation along the aa line was much smaller than that along the bb line because of the presence of stoppers at the periphery. The observed concave warpage deformation in the proof masses was suggested to result from numerous factors, such as the CTE mismatch between Au and Ti, increase in the size of the Au crystallites, 26 and the multilayered structures. The Ti/Au multi-layered structures would complicate the discussion on their deformation behavior.…”

Section: Resultsmentioning

confidence: 98%

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Warpage Study of Electrodeposited-Au Micro-Components with Ti/Au Multi-Layered Structures toward MEMS Applications

Omura,

Kurioka,

Chen

et al. 2024

J. Electrochem. Soc.

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Electrodeposited Au-based micro-electromechanical system (MEMS) capacitive accelerometers with Ti/Au multi-layered structures are promising devices for detecting very low accelerations due to the high mass density of Au. On the other hand, the large difference in the coefficients of thermal expansion (CTE) between Ti and Au causes warpage in the electrodeposited-Au proof masses in MEMS capacitive accelerometers, which reduces the accuracy of the acceleration sensing. In this study, the warpage behaviour of electrodeposited Au proof masses with Ti/Au structures was evaluated to clarify factors affecting their structural stability. Ti/Au multi-layered proof masses with four different multi-layered structures and seven different sizes were fabricated. The warpage of the proof mass was quantified by the height information determined by a 3D optical microscope. The 3D optical microscopy analyses showed that the observed concave warpage is suppressed by increasing the layer number of Ti/Au layered structures in the proof mass. The warpage is also investigated by finite element analysis (FEA) simulations. The experimental results are in good agreement with the FEA simulations.

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Section: Discussionmentioning

confidence: 93%

Section: Resultsmentioning

confidence: 98%