Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer

Microstructure Study of Diffusion Bonding of Centrifuged Structural Steel-Bronze

“…Temperature: temperature is a very important factor, because better diffusion occurs at high temperatures [6]. In this study, process temperature is 1000 ˚C.…”

“…It is due to complete solution of nickel in copper. On the other hand, with increasing temperature, the released oxygen content at the interface of copper-steel increases and decreases the bond strength [3][4][5][6]. However with increasing of pressure, voids arising from different inherent diffusion coefficient at interface (Kirkendall voids) decreases [7][8].…”

Deformation and fracture of diffusion-bonded Cu–Ni–Zn/Cu–Cr layered composite

“…No interfacial cracks around the indentation impression of Vickers hardness testing as shown inFig. 3(c)suggests that the bonding strength of Cu-Ni-Zn/Cu-Cr interface in the joined material is high enough to accommodate the localized plastic deformation around the Vickers hardness indenter[7,8,10].Fig. 4shows the variation of Vickers hardness values of as-bonded (solution-treated at the same time)…”

“…The typical methods to produce layered composite materials include the rolling, extrusion, explosive welding, diffusion bonding etc. Joining various materials can be achieved by the shear deformation on the contact surface induced by shear stress [1,2], by mechanochemical reaction [9] and/or by atomic diffusion induced by thermal activation [3,10]. For the reliability of layered composite materials, both mechanical and thermal bonding between dissimilar materials should be optimized.…”

The Interfacial Microstructure and Mechanical Properties of Diffusion-Bonded Joints of 316L Stainless Steel and the 4J29 Kovar Alloy Using Nickel as an Interlayer

“…Precipitation of an Al phase and the formation of a soft dendritic microstructure in the fusion were attributed to a worse performance. In order to further obtain a high strength and high stability dissimilar joints, a filler material that usually possessed good plasticity or an intermediary coefficient of thermal expansion between parent materials was adopted [14][15][16]. In this context, nickel was considered a suitable intermediate material because the thermal expansion coefficient of nickel was situated between 316 stainless steel and the 4J29 Kovar alloy, and other suitable properties, such as density, melting point, and crystal type, were similar to them.…”