Improving Wire Sweep Performance by Measuring Degree of Cure of Epoxy Mold Compounds

Abstract

The choice of epoxy mold compound (EMC) for an electronic package is based mostly on how much protection it provides to the active components in the package. But the choice is not a straightforward process. Rather it is mostly trial and error using different assembly parameters to find the most robust material while assembly defects are monitored. One such defect associated to EMC processing is wire sweep, and many studies have shown that it is mainly caused by viscosity changes in the EMC. In this study, samples of EMC in various stages of shelf life and staging times were analyzed for degree of cure using a method called differential scanning calorimetry (DSC). Samples are then processed at assembly for wire sweep measurement. It was found out that degree of cure increases with staging time at different rates for each shelf life. It was also found out that wire sweep did not only increase with degree of cure but it was also found to be predictable with respect to the latter. Using this information, the age and staging limit for each material was identified that would not cause wire sweep issues.