2022 IEEE 5th International Conference on Industrial Cyber-Physical Systems (ICPS) 2022
DOI: 10.1109/icps51978.2022.9816887
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Improving wafer map classification in Industry 4.0

Abstract: At the heart of Industry 4.0. lies the automation of manufacturing processes and interoperability of corresponding applications, in most cases utilizing Cyber-Physical Systems and Internet of Things. Used within diverse industrial areas across the world, these concepts gained more importance in recent years. In the semiconductor industry, continuous improvement of all involved processes is achieved by utilizing these concepts in many different stages of the manufacturing process. This work proposes a machine l… Show more

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